The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2018
Filed:
Nov. 25, 2014
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Sang Hoon Shin, Cheongju-si, KR;
Heyun Su Jang, Seoul, KR;
Chang Ho Lee, Seongnam-si, KR;
Hee Young Shin, Cheongju-si, KR;
Eun Jin Jung, Cheongju-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 23/544 (2006.01); H01L 21/027 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67294 (2013.01); H01L 21/02057 (2013.01); H01L 21/0274 (2013.01); H01L 21/304 (2013.01); H01L 21/3081 (2013.01); H01L 21/30604 (2013.01); H01L 21/30625 (2013.01); H01L 21/67155 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54493 (2013.01);
Abstract
A system for processing a wafer may use a wafer identification (ID) assigned by a wafer manufacturing company as an ID code of the wafer in managing the wafer by a semiconductor manufacturing company.