logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10023827 B1

PDFFull Text
Date of Patent:
Jul. 17, 2018

Filed:

May. 09, 2017

Cleaning composition for semiconductor substrate and cleaning method

Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Kenji Mochida, Tokyo, JP;

Motoyuki Shima, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Nicole M Buie-Hatcher

Assistant Examiner:

M Reza Asdjodi

Int. Cl.
CPC ...
C11D 11/00 (2006.01); C11D 3/37 (2006.01); C11D 7/50 (2006.01); B08B 7/00 (2006.01); C08F 120/18 (2006.01); C08F 120/24 (2006.01); C08F 120/28 (2006.01); C08F 132/08 (2006.01); C08K 5/092 (2006.01); C11D 3/20 (2006.01); C11D 3/24 (2006.01); C11D 3/43 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); B08B 7/0014 (2013.01); C08F 120/18 (2013.01); C08F 120/24 (2013.01); C08F 120/28 (2013.01); C08F 132/08 (2013.01); C08K 5/092 (2013.01); C11D 3/2086 (2013.01); C11D 3/245 (2013.01); C11D 3/373 (2013.01); C11D 3/43 (2013.01); C11D 7/50 (2013.01); C11D 11/0058 (2013.01); H01L 21/02052 (2013.01);
Abstract

A cleaning composition for a semiconductor substrate contains a solvent, and a polymer that includes a fluorine atom, a silicon atom or a combination thereof. The content of water in the solvent is preferably no greater than 20% by mass. The cleaning composition preferably further contains an organic acid which is a non-polymeric acid. The organic acid is preferably a polyhydric carboxylic acid. The acid dissociation constant of the polymer is preferably less than that of the organic acid. The solubility of the organic acid in water at 25° C. is preferably no less than 5% by mass. The organic acid is preferably a solid at 25° C.

Find Patent Forward Citations

Loading…