The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Apr. 28, 2015
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Jun Kato, Yokohama, JP;

Youji Kawasaki, Utsunomiya, JP;

Shiori Yonezawa, Tokyo, JP;

Toshiki Ito, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/46 (2006.01); C08F 2/50 (2006.01); C08G 61/04 (2006.01); C08F 222/10 (2006.01); G03F 7/00 (2006.01); C08F 220/10 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/033 (2006.01); H01L 21/266 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
C08F 222/1006 (2013.01); C08F 220/10 (2013.01); C08F 222/10 (2013.01); G03F 7/0002 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/266 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 21/4846 (2013.01); H05K 3/0017 (2013.01); H05K 3/061 (2013.01); C08F 2222/1026 (2013.01); H05K 2203/092 (2013.01);
Abstract

To provide a curable composition for nanoimprinting that can form a cured product that has a sufficiently cured surface and is less prone to a pattern collapse defect even when the curable composition is cured by a photo-nanoimprint method at a low exposure dose. To provide a nanoimprint method for forming such a cured product. To provide a cured product that is less prone to a pattern collapse defect even when cured at a low exposure dose, a method for producing such a cured product, a method for manufacturing an optical component, a method for manufacturing a circuit board, and a method for manufacturing an electronic component. A curable composition that satisfies the formula (1) in a cured state:≥1.10  (1)


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