The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2018
Filed:
Jun. 12, 2015
Applicant:
Sharp Kabushiki Kaisha, Sakai, Osaka, JP;
Inventors:
Masakazu Kamura, Sakai, JP;
Akiko Iwata, Sakai, JP;
Hiroshi Nakano, Sakai, JP;
Bai Zhang, Sakai, JP;
Hidetsugu Matsukiyo, Sakai, JP;
Shigeru Aomori, Sakai, JP;
Assignee:
Sharp Kabushiki Kaisha, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/039 (2006.01); F21V 9/16 (2006.01); G02B 5/20 (2006.01); F21V 9/30 (2018.01); F21Y 115/20 (2016.01); F21Y 115/10 (2016.01); H01L 27/32 (2006.01); H01L 31/055 (2014.01);
U.S. Cl.
CPC ...
G03F 7/039 (2013.01); F21V 9/16 (2013.01); F21V 9/30 (2018.02); G02B 5/201 (2013.01); F21Y 2115/10 (2016.08); F21Y 2115/20 (2016.08); H01L 27/322 (2013.01); H01L 27/3244 (2013.01); H01L 31/055 (2013.01); H01L 2227/323 (2013.01);
Abstract
A photosensitive resin composition includes a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light, and a wavelength conversion material dispersed in the photosensitive resin. The photosensitive resin and the wavelength conversion material meet (i) to (iv):