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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10017677 B1

PDFFull Text
Date of Patent:
Jul. 10, 2018

Filed:

Oct. 24, 2016

Heat-conductive fluorinated curable composition, cured product thereof, and electric/electronic part

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hidenori Koshikawa, Annaka, JP;

Akihiro Endo, Annaka, JP;

Assignee:

Shin-Etsu Chemical Co., Ltd., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08L 71/00 (2006.01); C08K 3/22 (2006.01); C09K 5/08 (2006.01); C08L 83/04 (2006.01); C09C 3/12 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C09K 5/08 (2013.01); C08K 3/22 (2013.01); C08L 71/00 (2013.01); C08L 83/04 (2013.01); C09K 5/14 (2013.01); C08K 7/18 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C09C 3/12 (2013.01);
Abstract

A heat-conductive fluorinated curable composition is provided comprising (A) an alkenyl-containing linear polyfluoro compound, (B) a fluorinated organohydrogensiloxane having a fluorinated organic group and SiH groups, (C) a platinum catalyst, (D) a heat-conductive filler, and (E) a fluorinated organosilicon compound having a fluorinated organic group and an alkoxy group. The composition allows for heavy loading of the heat-conductive filler and cures into a cured product having improved oil resistance and thermal conductivity.

Find Patent Forward Citations

Koshikawa, Hidenori. (2018). Heat-conductive fluorinated curable composition, cured product thereof, and electric/electronic part (U.S. Patent No. 10017677). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10017677

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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