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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10015877 B1

PDFFull Text
Date of Patent:
Jul. 03, 2018

Filed:

Sep. 10, 2015

Circuit board comprising heat transfer structure

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Tae Hong Min, Suwon-si, KR;

Myung Sam Kang, Hwaseong-si, KR;

Jin Hyuk Jang, Hanam-si, KR;

Young Gwan Ko, Seoul, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;

Attorney:

NSIP Law

Primary Examiner:

Mukund G Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H01L 23/3677 (2013.01); H01L 23/373 (2013.01); H01L 23/49827 (2013.01); H01L 21/4882 (2013.01); H01L 23/5389 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16265 (2013.01); H01L 2924/15311 (2013.01); H05K 1/0206 (2013.01); H05K 1/0207 (2013.01); H05K 2201/0323 (2013.01);
Abstract

A circuit board comprises a first heat transfer structure including graphite or graphene, wherein at least a portion of the first heat transfer structure is disposed inside an insulating member and a primer layer is disposed on a surface of the first heat transfer structure. The first heat transfer structure may comprise a plurality of monomers, the monomers including a primer layer disposed on at least one surface of at least one layer of graphite or graphene.

Find Patent Forward Citations

Min, Tae. (2018). Circuit board comprising heat transfer structure (U.S. Patent No. 10015877). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10015877

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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