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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10014177 B1

PDFFull Text
Date of Patent:
Jul. 03, 2018

Filed:

Oct. 07, 2013

Methods for processing electronic devices

Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Robert Alan Bellman, Painted Post, NY (US);

Dana Craig Bookbinder, Corning, NY (US);

Robert George Manley, Vestal, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Theresa Chang, Painted Post, NY (US);

Jeffrey John Domey, Elmira, NY (US);

Darwin Gene Enicks, Corning, NY (US);

Vasudha Ravichandran, Painted Post, NY (US);

Alan Thomas Stephens, II, Beaver Dams, NY (US);

John Christopher Thomas, Elmira, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:

Jeffrey A. Schmidt

Primary Examiner:

Scott W Dodds

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/20 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); Y02E 10/549 (2013.01); Y10T 156/10 (2015.01); Y10T 156/1052 (2015.01);
Abstract

Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

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