The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2018

Filed:

Jun. 13, 2016
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Atsushi Nakamura, Nagano, JP;

Tsukasa Nakanishi, Nagano, JP;

Yoichi Sasada, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 17/00 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 5/00 (2013.01); H01F 17/04 (2013.01); H01F 27/2804 (2013.01); H01F 27/323 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 41/042 (2013.01); H01F 41/043 (2013.01); H01F 41/045 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49069 (2015.01); Y10T 29/49071 (2015.01); Y10T 29/49073 (2015.01); Y10T 156/10 (2015.01);
Abstract

A coil substrate includes a stacked structure in which a plurality of structures are stacked, each of the structures including a first insulating layer and a wiring formed on the first insulating layer, which becomes a part of a spiral-shaped coil; and an insulating film that covers a surface of the stacked structure, the spiral-shaped coil being formed by connecting the wirings of the adjacent structures in series.


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