The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
May. 21, 2015
Freescale Semiconductor, Inc., Austin, TX (US);
Douglas M. Reber, Austin, TX (US);
Mehul D. Shroff, Austin, TX (US);
NXP USA, Inc., Austin, TX (US);
Abstract
A semiconductor device includes a circuitry die and a solar cell die. The circuitry die includes a plurality of interconnect layers on a front side of the circuitry die, a metallization layer on a back side of the circuitry die, and at least one TSV (through substrate via) that makes an electrical connection between a last metal interconnect layer on the front side of the circuitry die and the metallization layer on the back side of the circuitry die. The solar cell die is configured to power the circuitry die. The solar cell die includes a transparent contact on a front side of the solar cell die. A back side of the solar cell die is attached to the back side of the circuitry die and makes electrical contact with the metallization layer on the back side of the circuitry die.