The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2018

Filed:

Aug. 30, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Shintaro Hayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 23/3121 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01);
Abstract

An electronic component device, includes: a lead frame including a terminal portion, the terminal portion including a columnar electrode and a metal plating layer, wherein the metal plating layer is formed on a lower surface of the electrode and a portion of a side surface of the electrode; an electronic component mounted on the lead frame to be electrically connected to the terminal portion; and a sealing resin that seals the lead frame and the electronic component, wherein another portion of the side surface of the electrode is embedded in the sealing resin and the metal plating layer is exposed from the sealing resin.


Find Patent Forward Citations

Hayashi, Shintaro. (2018). Lead frame and electronic component device (U.S. Patent No. 10008437). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10008437

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…