The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Jun. 06, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Taryn J. Davis, Beacon, NY (US);
Jonathan R. Fry, Fishkill, NY (US);
Tuhin Sinha, Hackensack, NJ (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); G01N 29/06 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); G01N 29/0681 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 22/12 (2013.01); H01L 22/34 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 2225/06596 (2013.01);
Abstract
A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.