The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2018
Filed:
Mar. 07, 2014
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Tzung-Chen Wu, Hsinchu, TW;
Wen-Zhan Zhou, Zhubei, TW;
Heng-Jen Lee, Baoshan Township, TW;
Ho-Yung David Hwang, ChuPei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D 19/00 (2006.01); H01L 21/67 (2006.01); F27B 17/00 (2006.01);
U.S. Cl.
CPC ...
F27D 19/00 (2013.01); F27B 17/0025 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/67288 (2013.01); F27D 2019/0003 (2013.01);
Abstract
An adaptive baking system includes a baking chamber configured to receive a wafer, and a heating element configured to support the wafer. The adaptive baking system further includes a controller configured to receive temperature information related to the heating element and the wafer, wherein the controller is further configured to adjust an amount of heat provided by the heating element during a baking process in response to the temperature information.