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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10005991 B1

PDFFull Text
Date of Patent:
Jun. 26, 2018

Filed:

Oct. 09, 2014

Removal composition for selectively removing hard mask and methods thereof

Applicants:

E. I. Du Pont DE Nemours and Company, Wilmington, DE (US);

Ekc Technology Inc, Hayward, CA (US);

Inventor:

Hua Cui, Castro Valley, CA (US);

Assignees:

EKC TECHNOLOGY INC, , CA (US);

E I DU PONT DE NEMOURS AND COMPANY, Wilmington, DE (US);

Attorney:

Simon L. Xu

Primary Examiner:

Gregory Webb

Int. Cl.
CPC ...
C11D 7/32 (2006.01); C11D 11/00 (2006.01); G03F 7/42 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); C23F 1/28 (2006.01); C23F 1/34 (2006.01); C23F 1/38 (2006.01); C23F 1/40 (2006.01); C11D 3/39 (2006.01); C11D 7/26 (2006.01); B08B 3/08 (2006.01); C11D 7/04 (2006.01); B08B 3/10 (2006.01); C11D 3/20 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); C11D 3/2082 (2013.01); C11D 3/3942 (2013.01); C11D 3/3947 (2013.01); C11D 7/04 (2013.01); C11D 7/265 (2013.01); C11D 7/3209 (2013.01); C11D 7/3218 (2013.01); C11D 7/3245 (2013.01); C11D 7/3281 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); C23F 1/28 (2013.01); C23F 1/34 (2013.01); C23F 1/38 (2013.01); C23F 1/40 (2013.01); G03F 7/423 (2013.01); G03F 7/425 (2013.01); G03F 7/426 (2013.01); H01L 21/02057 (2013.01); H01L 21/02063 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 21/76807 (2013.01); H01L 21/76814 (2013.01); H01L 21/31144 (2013.01);
Abstract

The present disclosure relates to a method for removing a hard mask consisting essentially of TiN, TaN, TiNxOy, TiW, W, Ti and alloys of Ti and W from a semiconductor substrate. The method comprising contacting the semiconductor substrate with a removal composition. The removal composition comprises 0.1 wt % to 90 wt % of an oxidizing agent; 0.0001 wt % to 50 wt % of a carboxylate; and the balance up to 100 wt % of the removal composition comprising deionized water.

Find Patent Forward Citations

Cui, Hua. (2018). Removal composition for selectively removing hard mask and methods thereof (U.S. Patent No. 10005991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10005991

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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