The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

May. 18, 2016
Applicant:

Fairchild Semiconductor Corporation, Sunnyvale, CA (US);

Inventors:

Salman Akram, Boise, ID (US);

Venkat Ananthan, Cupertino, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/51 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 21/04 (2006.01); H01L 29/78 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/513 (2013.01); H01L 21/049 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/7802 (2013.01); H01L 29/7813 (2013.01); H01L 29/7395 (2013.01); H01L 29/7397 (2013.01);
Abstract

In a general aspect, a power semiconductor device can include a silicon carbide (SiC) substrate and a SiC epi-layer disposed on the SiC substrate. The device can also include a first well region, a second well region disposed in the SiC epi-layer, a first source region disposed in the first well region, and a second source region disposed in the second well region. The device can further include a gate structure disposed on the SiC epi-layer and extending between the first source region and the second source region. The gate structure can include a hybrid gate dielectric. The hybrid gate dielectric can include a first high-k dielectric material and a second high-k dielectric material. The device can also include a conductive gate electrode disposed on the hybrid gate dielectric.


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