The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

May. 23, 2012
Applicants:

Sun-rong Jan, New Taipei, JP;

Che-yu Yeh, New Taipei City, TW;

Chee Wee Liu, Taipei, TW;

Chien-hua Huang, Zhubei, TW;

Bing J. Sheu, Hsin-Chu, TW;

Inventors:

Sun-Rong Jan, New Taipei, JP;

Che-Yu Yeh, New Taipei City, TW;

Chee Wee Liu, Taipei, TW;

Chien-Hua Huang, Zhubei, TW;

Bing J. Sheu, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device comprises a substrate with a first side and a second side, wherein a plurality of active circuits are formed adjacent to the first side of the substrate and a plurality of through silicon vias arranged in a polygon shape and extending from the first side of to the second side, wherein the polygon shape has more than six sides, and wherein each through silicon via is placed at a corresponding apex of the polygon shape.


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