The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Mar. 22, 2016
Applicant:
Veeco Instruments Inc., Plainview, NY (US);
Inventors:
Alexander I. Gurary, Bridgewater, NJ (US);
Mikhail Belousov, Plainsboro, NJ (US);
Vadim Boguslavskiy, Princeton, NJ (US);
Bojan Mitrovic, Somerset, NJ (US);
Assignee:
Veeco Instruments Inc., Plainview, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); C23C 16/4584 (2013.01); C23C 16/45521 (2013.01); C23C 16/52 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/67109 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01);
Abstract
Wafer treatment process and apparatus is provided with a wafer carrier arranged to hold wafers and to inject a fill gas into gaps between the wafers and the wafer carrier. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers.