Acm Research (Shanghai) Inc.

Zhenming Chu

Hui Wang

Xi Wang

Jun Wu

Fuping Chen

Xiaoyan Zhang

Xuejun Li

Shena Jia

Cheng Cheng

Deyun Wang

Zeran Li

Disclosed is a wafer backside cleaning method, comprising: using a wafer clamping part to hold a wafer, a gap being formed between the wafer clamping part and the wafer; injecting a protective gas into the gap at a first flow rate; adjusting the flow rate of the protective gas from the first flow rate to a second flow rate, and rotating the wafer under the drive of the first rotational speed of the wafer clamping part to clean the backside of the wafer; adjusting the rotational speed of the wafer clamping part from the first rotational speed to a second rotational speed, so that the wafer is driven by the wafer clamping part to rotate for the drying process; stopping rotating the wafer, adjusting the flow rate of the protective gas to the first flow rate again from the second flow rate, and then taking out the wafer; and stopping injecting the protective gas after the wafer is taken out. According to the present invention, adjusting the switching logic and flow rate of the protective gas can ensure that the front side of the wafer is not prone to adsorption of external impurities during a wafer backside cleaning process, thereby improving the wafer backside cleaning stability.

Wafer backside cleaning method

A substrate cleaning apparatus, including a chuck assembly, at least one first nozzle (), and an ultra or mega sonic device (). The chuck assembly is configured to receive and clamp a substrate. The at least one first nozzle () is configured to spray liquid onto the top surface of the substrate. The ultra or mega sonic device () is configured to dispose above the top surface of the substrate for providing an ultra or mega sonic cleaning to the substrate. A gap is formed between the ultra or mega sonic device () and the top surface of the substrate, and the gap is fully and continuously filled with the liquid so that the entire underneath of the ultra or mega sonic device () is filled with the liquid all the time during the cleaning process.

Substrate cleaning apparatus

A fall-proof apparatus for cleaning semiconductor devices is provided. The fall-proof apparatus comprises: a nozzle () connecting with a carrier (); a megasonic/ultrasonic device () fixing on the carrier (); and a sensor () detecting the distance between the megasonic/ultrasonic device () and the carrier () to determine whether the megasonic/ultrasonic device () is loose and going to fall. The megasonic/ultrasonic device works with the nozzle during a cleaning process. A chamber with the fall-proof apparatus is also provided.

Fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus

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Shanghai, China

Zhenming Chu