Applied Materials, Inc.

Zheng Min Clarence Chong

Siew Kit Hoi

Xinxin Wang

Yaoying Zhong

Yuichi Wada

Chul Nyoung Lee

Kok Wei Tan

Kok Seong Teo

Methods and apparatus for performing physical vapor deposition in a reactor chamber to form aluminum material on a substrate including: depositing a first aluminum layer atop a substrate to form a first aluminum region having a first grain size and a first temperature; and cooling the first aluminum region atop a substrate to a second temperature at a rate sufficient to increase the first grain size to a second grain size.

Methods and apparatus for depositing aluminum by physical vapor deposition (PVD) with controlled cooling

Methods and apparatus for protecting parts of a process chamber from thermal cycling effects of deposited materials. In some embodiments, a method of protecting the part of the process chamber includes wet etching the part with a weak alkali or acid, cleaning the part by bead blasting, coating at least a portion of a surface of the part with a stress relief layer. The stress relief layer forms a continuous layer that is approximately 50 microns to approximately 250 microns thick and is configured to preserve a structural integrity of the part from the thermal cycling of aluminum deposited on the part. The method may also include wet cleaning of the part with a heated deionized water rinse after formation of the stress relief layer.

Methods and apparatus for prevention of component cracking using stress relief layer

Growing community of inventors

Singapore, Singapore

Zheng Min Clarence Chong