Screen Holdings Co., Ltd.

Yuta Nakano

Takayoshi Tanaka

Tomomi Iwata

Tetsuya Emoto

Atsuro Eitoku

Hiroki Taniguchi

Akihiko Taki

Yuya Tsuchihashi

Takashi Akiyama

Masafumi Inoue

Takaaki Ishizu

Akira Oato

Teppei Nakano

Reo Tamura

A substrate processing method includes a step of supplying a dry processing liquid onto the upper surface of the substrate, to thereby form a liquid film of the dry processing liquid on the upper surface of the substrate (Step S), a step of heating the substrate from the side of a lower surface thereof in a state where the liquid film of the dry processing liquid is formed on the upper surface thereof (Step S), and a step of drying the substrate (Step S). The surface tension of the dry processing liquid is lower than that of the rinse liquid. The boiling point of the dry processing liquid is higher than that of the rinse liquid. The heating temperature of the substrate in Step Sis not lower than the boiling point of the rinse liquid and lower than that of the dry processing liquid.

Substrate processing method and substrate processing apparatus

A substrate processing device includes a substrate holding table, an ultraviolet irradiator, a tubular member, a first gas supplying unit, and a second gas supplying unit. The ultraviolet irradiator is disposed facing to the substrate through an active space and configured to irradiate the substrate with ultraviolet light. The tubular member includes an inner surface surrounding a side surface of the substrate holding table, and at least one opening at a position facing to the side surface on the inner surface. The first gas supplying unit supplies gas to a space between the side surface of the substrate holding table and the inner surface of the tubular member through the at least one opening. The second gas supplying unit supplies gas to an active space between the substrate and the ultraviolet irradiator.

Substrate processing device, substrate processing method, and substrate processing system

A substrate processing method includes a rinse liquid supplying step of supplying a rinse liquid containing water to a major surface of a substrate, a rotating step of rotating the substrate around a rotation axis passing through a central portion of the major surface of the substrate, and a hydrophobizing agent supplying step of supplying a hydrophobizing agent containing a first dissolving agent to the major surface of the substrate to replace a liquid held on the major surface of the substrate with the hydrophobizing agent in parallel with the rotating step after the rinse liquid supplying step is performed, and the hydrophobizing agent supplying step includes a hydrophobizing agent discharging step of discharging a continuous flow of the hydrophobizing agent from a discharge port of a nozzle toward the major surface of the substrate held by a substrate holding unit with a Reynolds number at the discharge port being not more than 1500.

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Kyoto, Japan

Yuta Nakano