Tokyo Electron Limited

Yusuke Tachino

Shigeru Nakajima

Hiromi Shima

Hiroaki Ikegawa

Katsushige Harada

Yoshihiro Takezawa

There is provided a metal contamination prevention method performed by passing a metal chloride gas through a metal component having a surface covered with an inactive film formed of a chromium oxide, the method including: generating a chromium chloride (III) hexahydrate by supplying a hydrochloric acid to the inactive film covering the surface of the metal component and allowing the chromium oxide to react with the hydrochloric acid; removing a chromium from the inactive film by evaporating the chromium chloride (III) hexahydrate; and covering a surface of the inactive film with a compound containing a metal contained in the metal chloride gas.

Metal contamination prevention method and apparatus, and substrate processing method using the same and apparatus therefor

Provided is a method of controlling a gas supply apparatus including a vaporizer, a carrier gas supply source and a gas supply line, the method including: supplying a liquid or sold raw material to a raw material container included in a vaporizer; vaporizing the liquid or sold raw material in the raw material container to produce a raw material gas; exhausting an interior of the raw material container having the liquid or sold raw material; supplying a carrier gas from the carrier gas supply source to the raw material container; and flowing the raw material gas and the carrier gas from the raw material container to a processing chamber in which a substrate to be processed is accommodated via the gas supply line.

Method of controlling gas supply apparatus and substrate processing system

A film forming apparatus, which forms a thin film formed of a metal oxide on a substrate by alternately supplying a raw material gas formed of an organic material containing a metal and an oxidation gas for oxidizing the organic material to the substrate a plurality of times, within a reaction vessel under a vacuum atmosphere, is provided. A control part outputs a control signal for comparing a moisture concentration detected by a moisture detection part with a set value after initiation of a step of supplying the oxidation gas and before starting a step of supplying the raw material gas, and when the moisture concentration exceeds a set value, for increasing a substitution operation of an atmosphere substitution step.

Film forming method, film forming apparatus, and storage medium

The present disclosure provides a heat treatment method, in which a substrate supporter supporting a plurality of substrates in the configuration of a shelf thereon is loaded in a vertical reaction tube surrounded by a heating mechanism and a heat treatment is performed. The method includes discharging a processing gas from a gas nozzle provided in the reaction tube to extend in a vertical direction of the substrate supporter, and supplying a temperature adjusting fluid into a flow path forming member provided to surround the gas nozzle in the reaction tube and adjusting a temperature of the processing gas in the gas nozzle.

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Nirasaki, Japan

Yusuke Tachino