Napra Co., Ltd.

Yurina Sekine

Shigenobu Sekine

Yoshiharu Kuwana

Ryuji Kimura

Kazutoshi Kamibayashi

Hiroaki Ikeda

A method for forming a functional part in a minute space includes the steps of: filling a minute space with a dispersion functional material in which a thermally-meltable functional powder is dispersed in a liquid dispersion medium; evaporating the liquid dispersion medium present in the minute space; and heating the functional powder and hardening it under pressure.

Method for forming functional part in minute space

A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si&#x2014;O bond region obtained by reacting Si particles with an organic Si compound.

Substrate with built-in passive element

A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold.

Substrate for electronic device and electronic device

An insulating paste includes insulating particles, Si particlesand an organic Si compound. The organic Si compoundreacts with the Si particlesto form a Si&#x2014;O bond filling up the space around the insulating particles

Insulating paste, electronic device and method for forming insulator

An electronic device includes a semiconductor substrate, an insulating material-filled layer and a vertical conductor. The semiconductor substrate has a vertical hole extending in a thickness direction thereof. The insulating material-filled layer is a ring-shaped layer filled in the vertical hole for covering an inner periphery thereof and includes an organic insulating material or an inorganic insulating material mainly of a glass and a nanocomposite ceramic. The nanocomposite ceramic has a specific resistance of greater than 10&#x3a9;&#xb7;cm at room temperature and a relative permittivity of 4 to 9. The vertical conductor is a solidified metal body filled in an area surrounded by the insulating material-filled layer.

Electronic device and manufacturing method therefor

A semiconductor substrate includes a vertical conductor and an insulating layer. The vertical conductor includes a metal/alloy component of a nanocomposite crystal structure and is filled in a vertical hole formed in the semiconductor substrate along its thickness direction. The insulating layer is formed around the vertical conductor in a ring shape and includes nm-sized silica particles and a nanocrystal or nanoamorphous silica filling up a space between the silica particles to provide a nanocomposite structure along with the silica particles.

Semiconductor substrate, eletronic device and method for manufacturing the same

An integrated circuit device includes a semiconductor substrate, an active element and a passive element. The active element is made of the semiconductor substrate. The passive element includes a functional element filled in a groove or hole provided in the semiconductor substrate along a thickness direction thereof and is electrically connected to the active element. The functional element has a Si&#x2014;O bond region obtained by reacting Si particles with an organic Si compound.

Integrated circuit device

The present invention provides a method for producing nanometer-size spherical particles. The method includes a first step for producing intermediate spherical particles. The intermediate spherical particles include a polycrystalline or single-crystalline region, having a particle size of 1 to 300 &#x3bc;m. The method of the present invention further includes a second step for producing final spherical particles. The second step uses a swirling plasma gas flow having the central axis thereof, the central axis running through an area between an anode and a cathode of a plasma generator. The intermediate spherical particles are discharged along the axis to subject the intermediate spherical particles to a plasma atmosphere of the area to form the final spherical particles.

Method for producing spherical particles, having nanometer size, crystalline structure, comprising providing a swirling plasma gas flow

A functional material includes at least two kinds of particles selected from the group consisting of first metal composite particles, second metal composite particles and third metal composite particles. The first metal composite particles, the second metal composite particles and the third metal composite particles each contain two or more kinds of metal components. The melting point T(&#xb0; C.) of the first metal composite particles, the melting point T(&#xb0; C.) of the second metal composite particles and the melting point T(&#xb0; C.) of the third metal composite particles satisfy a relationship of T&#x3e;T&#x3e;T

Functional material

Semiconductor substrate, electronic device and method for manufacturing the same

A wiring substrate includes a semiconductor substrate, an insulator and a plurality of columnar conductors. The insulator is made of an insulating material filled in a groove or hole provided in the semiconductor substrate. The plurality of columnar conductors are filled in grooves or holes provided in the insulator. The grooves or holes are arranged at a narrow pitch in a plane of the insulator. The insulating material has a Si&#x2014;O bond obtained by reacting Si particles with an organic Si compound.

Wiring substrate and manufacturing method therefor

A light-emitting device includes a light-emitting element and a support substrate. The light-emitting element has an insulating layer and first and second vertical conductors passing through the insulating layer. The support substrate has a substrate part and first and second through electrodes and is disposed on the insulating layer. The first through electrode passes through the substrate part with one end connected to an opposing end of the first vertical conductor, while the second through electrode passes through the substrate part with one end connected to an opposing end of the second vertical conductor. The opposing ends of the first and second vertical conductors are projected from a surface of the insulating layer and connected to the ends of the first and second through electrode inside the support substrate.

Light-emitting device comprising vertical conductors and through electrodes and method for manufacturing the same

A method includes applying, between connection conductors of adjacent substrates, a junction material containing the first metal or alloy component and the second metal or alloy component having a higher melting point than said first metal or alloy component. The method further includes melting the junction material by a heat treatment.

Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method

The present invention provides nanometer-size spherical particles. Each of the particles is made of at least one selected from the group consisting of a metal, an alloy, and a metal compound. The particles include one or both of a polycrystalline region and a single-crystalline region. The particles have a particle size of less than 1 &#x3bc;m; and a sphericity of &#x2212;10% to +10%.

Spherical particles having nanometer size, crystalline structure, and good sphericity and method for producing the same

A circuit board includes a substrate, a circuit pattern and a through electrode. The circuit pattern is disposed on one side of the substrate in a thickness direction thereof. The through electrode is filled in a through-hole formed in the substrate with one end connected to the circuit pattern. The circuit pattern and the through electrode each have an area containing a noble metal component (e.g., Au component) and are connected to each other therethrough.

Growing community of inventors

Tokyo, Japan

Yurina Sekine