Taiwan Semiconductor Manufacturing Comp. Ltd.

Coretronic Corporation

Yung-Ta Chen

Fan-Chieh Chang

Wen-Chih Yang

Sheng-Yu Chiu

An illumination system for a projection apparatus includes a light source module, an integrating rod and an optical detecting module. The light source module is capable of emitting an illuminating light beam. The integrating rod has a light entrance surface facing toward the light source module. The optical detecting module includes a light guiding device and an optical detecting device. The light guiding device has a first end surface and a second end surface. The first end surface is farther away from the light entrance surface of the integrating rod than the second end surface. The optical detecting device is disposed adjacent to the first end surface of the light guiding device and electrically connected to the light source module. The light source module is capable of adjusting intensity of the illuminating light beam according to randomly emitted light detected by the optical detecting device.

Illumination system

An improved method and apparatus for applying a primer to a wafer surface prior to coating the wafer with photoresist is provided. The method comprises priming a wafer with HMDS, removing the wafer from the priming chamber, and closing the chamber. Next, the chamber, piping and primer source are evacuated. The bubbler canister, piping and wafer chamber are held at a pressure of about 15 inches H.sub.2 O while the priming tool is idle between wafer priming operations. By maintaining the vaporizer, piping and wafer chamber at a partial vacuum, the primer will be prevented from condensing and forming harmful droplets on the wafer surface. The invention prevents primer condensation from forming on the wafer, thus improving photolithographic yields and device yields.

Apparatus to apply photoresist primer to a wafer

An improved method for applying a primer to a wafer surface prior to coating the wafer with photoresist is provided. The method comprises priming a wafer with HMDS, removing the wafer from the priming chamber, and closing the chamber. Next, the chamber, piping and primer source are evacuated. The bubbler canister, piping and wafer chamber are held at a pressure of about 15 inches H.sub.2 O while the priming tool is idle between wafer priming operations. By maintaining the vaporizer, piping and wafer chamber at a partial vacuum, the primer will be prevented from condensing and forming harmful droplets on the wafer surface. The invention prevents primer condensation from forming on the wafer, thus improving photolithographic yields and device yields.

Growing community of inventors

Hsin-Chu, Taiwan

Yung-Ta Chen