Taiwan Semiconductor Manufacturing Comp. Ltd.

Yung-Chih Chang

Chih-Wing Chang

Kai-Hsiung Chen

Chun-Ming Hu

Cheng-I Sun

Fu-Kun Yeh

Chun-I Kuo

Hsueh-Chi Shen

A mask storage device for storing a mask used in lithography comprises a desiccant retainer for receiving a desiccant, the desiccant retainer comprising one or more passages. The mask storage device also comprises a first shell and a second shell, the second shell removably attached to the first shell and arranged to form a sealed space with the first shell in a closed state. The desiccant retainer is positioned in the sealed space. The mask storage device also comprises a gasket positioned between the first shell and the second shell. The gasket is configured to create a sufficiently airtight seal between the first shell and the second shell in the closed state. The one or more passages of the desiccant retainer comprise one or more membranes.

Mask storage device for mask haze prevention

A mask storage device and a method of preventing defect formation on a mask are provided. The method includes providing a mask storage device comprising a first and second shell configured to form a sealed space in a closed state and a desiccant positioned within the mask storage device. The method further includes placing a mask inside the mask storage device and sealing the mask storage device with the mask and desiccant inside the sealed space.

Mask storage device for mask haze prevention and methods thereof

A thermal process system. The thermal process system comprises a thermal processor, a metrology tool, and a controller. The thermal processor performs a thermal process as defined by a heating model to form a film on a wafer surface. The metrology tool, interfaced with the thermal processor, inspects thickness of the film. The controller, coupled with the thermal processor and the metrology tool, generates the heating model of the thermal processor and calibrates the heating model according to a preset slope coefficient matrix and the measured thickness.

Method and system for thermal process control

An exposure system and method for use in an exposure tool. The system includes a compensation unit and an exposure unit. The compensation unit receives a fine-tuning value for an overlay correction parameter for a product in a first run. The compensation unit further receives an adjustment period for an exposure tool, an adjustment time for the exposure tool, and a process time for the product in a second run. The compensation unit also receives an equipment baseline offset of the exposure tool after adjustment, and compensates the fine-tuning value for the overlay correction parameter for the product accordingly. The exposure tool performs overlay processes on a wafer according to the compensated fine-tuning value for the overlay correction parameter.

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Zhutian, Taiwan

Yung-Chih Chang