Hoechst Japan Limited

Yuko Nozaki

Takanori Kudo

Hiroshi Okazaki

Yoshiaki Kinoshita

Seiya Masuda

Munirathna Padmanaban

Natsumi Suehiro

Yuki Nanjo

Kazuya Nagao

Georg Pawlowski

Klaus Jurgen Przybilla

A photosensitive resin composition is disclosed. The photosensitive resin composition is characterized by containing (a) a reaction product of a polymer having a specific segment with (3,4-epoxycylohexyl)-methyl methacrylate, (b) a polymerization initiator allowing the initiation of the polymerization of said reaction product when irradiated with an actinic radiation, and (c) a solvent. Preferably, the composition further contains (d) a thermal crosslinker, a compound having a polymerizable unsaturated bond and/or a pigment in addition to the above ingredients. According to the present invention, there is provided the photosensitive resin composition which has such excellent characteristics that it has high sensitivity, it does not require a heat treatment between exposure-development steps, it causes little change of sensitivity and pattern shape with time from the exposure to the development, it has high heat resistance, it permits the use of an aqueous system in the development step and it has good storage stability.

Photosensitive resin composition for color filter production

A radiation-sensitive mixture for use in the production of semiconductor elements, which has high sensitivity and high resolution, which can be developed by an aqueous alkaline solution, and which is based on a novel concept in that a stable acid latent image is controlled by using a radiation-decomposable base. The mixture is characterized by comprising as essential components a) a binder which is insoluble in water but soluble in an aqueous alkaline solution; b.sup.1) a compound having at least one bond which can be cleaved by an acid, or b.sup.2) a compound having at least one bond which is crosslinked with the compound a) by an acid; c) a compound which generates an acid when irradiated; and d) a basic iodonium compound.

Radiation-sensitive mixture comprising a basic iodonium compound

Colored, photosensitive resin composition

A chemically amplified radiation sensitive composition comprising: (a) a copolymer such as poly(4-hydroxystyrene-co-styrene), (b) a dissolution inhibitor such as polyacetal or (b') a crosslinking agent, (c) a radiation sensitive compound capable of generating an acid upon exposure to actinic radiation, (d) a radiation sensitive base capable of stabilizing the width of lines throughout steps from exposure to post-exposure bake treatment, and (e) a solvent for dissolving the components (a) to (d), can realize fine lines and spaces down to 0.22 microns, for example, using KrF laser, and possesses excellent heat and etch resistance and adhesiveness to substrates, and produces patterns with low standing waves arising due to substrate reflectiveness of exposed light.

Radiation sensitive composition

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Saitama, Japan

Yuko Nozaki