Tokyo Electron Limited

Yukinobu Otsuka

Yasuhiro Kuga

Shinsuke Takaki

Koji Ushimaru

Hibiki Otani

Shinichi Sagara

Ryohei Fujise

A substrate processing apparatus includes: a heat processing unit configured to perform a heat process on a substrate having a film formed on the substrate; and a control unit configured to control the heat processing unit, wherein the heat processing unit comprises: a heater configured to support and heat the substrate; a chamber configured to cover the substrate supported on the heater; a gas ejector having a head in which ejection holes are formed, and configured to eject a gas from the ejection holes toward a surface of the substrate; an outer peripheral exhauster configured to evacuate a processing space inside the chamber from an outer peripheral region located further outward than a peripheral edge of the substrate supported on the heater; and a central exhauster configured to evacuate the processing space from a central region located further inward than the peripheral edge of the substrate supported on the heater.

Substrate processing apparatus, substrate processing method, and storage medium

A heat treatment apparatus for heating, in a treatment container, a substrate on which a coating film is formed. The heat treatment apparatus includes: a mount provided in the treatment container and which mounts the substrate thereon; a heating part that heats the substrate mounted on the mount; a suction pipe leading to a suction port formed in the mount, penetrating the mount, and extending directly downward; and a collection container provided on a suction path between the suction pipe and a suction mechanism. The collection container is provided directly below the mount in plan view and connected to the suction pipe to collect a sublimate in the treatment container.

Heat treatment apparatus and heat treatment method

A substrate heating device includes: a heating plate for heating a first substrate mounted thereon; a cooling plate installed adjacent to the heating plate and for mounting a second substrate, before being heated, introduced to the cooling plate, and cool the first substrate; a substrate transfer mechanism for transferring the first or second substrate between the cooling plate and the heating plate; a heat shielding plate installed across a region below the heating plate and the cooling plate; a cooling mechanism for cooling the heat shielding plate; and a low oxygen atmosphere forming part for setting an atmosphere in which the first substrate is heated to a low oxygen atmosphere, wherein the substrate transfer mechanism includes a substrate holding part for holding the first or second substrate and a moving mechanism installed below the heat shielding plate to move the substrate holding part in the front-back direction.

Growing community of inventors

Koshi, Japan

Yukinobu Otsuka