Fujitsu Component Limited

Asm IP Holding B.v.

Asm Japan K.k.

Fujitsu Takamisawa Component Limited

Panasonic Corporation

Nagano Fujitsu Component Limited

Yukihiro Mori

Sumio Watanabe

Masahiro Tsuchiya

Yoshinari Takabatake

Tetsuhiro Ishikawa

Tatsuya Oguchi

Fumio Sakurai

Masaru Kihara

Yuji Yada

Toshio Yamaguchi

Kunihiko Funada

Naoto Tsuji

Masafumi Chiba

Suvi P Haukka

Satoshi Takahashi

Eva E Tois

Antti Niskanen

Jun Kawahara

Raija H Matero

Akira Shimizu

Atsuki Fukazawa

Hideaki Fukuda

Takayuki Yamagishi

Hidemi Suemori

Hiromi Ohtsuka

Yoshinori Sata

Yoichi Takamura

Jaako Anttila

Takashi Nakajima

Masami Suzuki

Michael A Todd

Satoshi Koizumi

Toshiyuki Kobayashi

Norio Endo

Kiyoshi Sato

Jaakko Anttila

Kiyohiro Matsushita

Timothee Blanquart

Rintaro Kato

Takahiro Onuma

Masaki Yoshimaru

Keiji Miyatsu

Mikio Shimizu

Yuya Nonaka

Makoto Igarashi

Shinya Yoshimoto

Hiroki Arai

Takeshi Miyahara

Tominori Yoshida

Vincent Hubert Bernard Gilles Babin

Yuya Ishii

Tadashi Ohtaka

Shuko Yamaji

Tomoyuki Yokoyama

Ryo Kawaguchi

Sho Chiba

Satoshi Segawa

Masami Ishizawa

Rene Henricus Jozef Vervuurt

Melvin Verbaas

A gas distribution assembly and methods for adjusting the gas flow through a gas supply unit into a reaction chamber are disclosed. The gas distribution assembly and methods can be used to increase or decrease gas flow uniformly through the gas supply unit. The gas distribution assembly and methods can also be used to increase gas flow into one area of the reaction chamber, while decreasing gas flow into another area.

Gas distribution assembly

In accordance with some embodiments herein, methods and apparatuses for flowable deposition of thin films are described. Some embodiments herein relate to cyclical processes for gap-fill in which deposition is followed by a thermal anneal and repeated. In some embodiments, the deposition and thermal anneal are carried out in separate station. In some embodiments second module is heated to a higher temperature than the first station. In some embodiments, the thermal anneal comprises RTA.

Methods and apparatuses for flowable gap-fill

A vacuum process module has a pre-shaped ceiling and/or bottom that is shaped to bulge outwards. The shape of the ceiling and/or process modules counteracts deformation caused by vacuum pressures and/or high temperatures when processing substrates in the process module. The process module may have a side openable to a transfer chamber and an opposite side opposite the openable side. The bulge may be asymmetric, with the peak of the bulge off-center on the ceiling and closer to the opposite side than to the openable side. A rigid structure may be mounted on the ceiling to adjust the magnitude of the bulge in the ceiling. The beam may be, e.g., a rigid beam having an adjustable lift mechanism for lifting up an attached part of the ceiling. The process module may accommodate a plurality of substrates for processing, with each substrate occupying a dedicated stage in the process module.

Multi-stage substrate processing system

An apparatus for processing a substrate may comprise a reaction chamber, a substrate support disposed within the reaction chamber and provided with a support surface to support the substrate, and a motor to provide a rotary movement, wherein the motor is controlled and configured to create a bidirectional rotary movement between the reaction chamber and the substrate support around an axis perpendicular to the support surface.

Rotating substrate support

In accordance with some embodiments herein, apparatuses for deposition of thin films are provided. In some embodiments, a plurality of stations is provided, in which each station provides a different reactant or combination of reactants. The stations can be in gas isolation from each other so as to minimize or prevent undesired chemical vapor deposition (CVD) and/or atomic layer deposition (ALD) reactions between the different reactants or combinations of reactants.

Apparatuses for thin film deposition

A susceptor includes a plate part, a first heater for heating a first portion of the plate part, a second heater for heating a second portion of the plate part, and a heat insulating portion for thermally insulating the first portion and the second portion from each other on an upper surface side of the plate part.

Susceptor having cooling device

Examples of a system dedicated for parts cleaning includes a gas supply apparatus configured to supply a cleaning gas, a first adapter connected to a gas supply port of the gas supply apparatus, an exhaust system configured to exhaust the gas supplied from the gas supply apparatus, and a second adapter connected to a gas inlet of the exhaust system.

System dedicated for parts cleaning

A substrate processing apparatus includes a stage provided in a chamber, a shower head in which a plurality of slits are formed and which is opposed to the stage, a first gas supply part which supplies a first gas to a space between the stage and the shower head via the plurality of slits, and a second gas supply part which supplies a second gas which is not a noble gas to a region below the stage, wherein the second gas is the same gas as one of a plurality of kinds of gases constituting the first gas in a case where the first gas is a mixture gas constituted of the plurality of kinds of gases, and the second gas is the same gas as the first gas in a case where the first gas is a single kind of gas.

Substrate processing apparatus and method of processing substrate

A semiconductor processing system comprises a first, a second, and a third process module assembly. The third process module assembly is between the first and the second process module assemblies, and includes an opening for providing substrates to be processed in the various process module assemblies. The process modules are arranged laterally relative to the opening. The first and second process module assemblies each include an associated transfer chamber, an associated substrate transfer device, and a plurality of associated process modules attached the associated transfer chamber. The third process module assembly may include an associated transfer chamber, an associated substrate transfer device, and a single associated process module attached to the associated transfer chamber. The processing system is configured to sequentially load substrates into the process module assemblies neighboring the third process module assembly, and lastly load substrates into the process module of the third process module assembly.

High-throughput, multi-chamber substrate processing system

A communication system includes an information terminal, and a printing apparatus configured to perform intergroup communication with the information terminal belonging to a group. The printing apparatus includes a printing part configured to perform printing, a data receiver configured to receive print data from the information terminal via the intergroup communication, and a print controller configured to control the printing part using the received print data.

Communication system and printing apparatus

A sheet cassette configured to store a recording sheet and connectable to a printer includes a battery, a storage, a communication terminal, and an electrode terminal. The storage is configured to store information. The sheet cassette is configured to perform communications between the sheet cassette and the printer through the communication terminal. The sheet cassette is configured to supply the electric power of the battery to the printer through the electrode terminal.

Sheet cassette and printing system

Examples of a substrate processing apparatus include a stage, an outer peripheral ring that surrounds the stage while provided with a gap between a side surface of the stage and the outer peripheral ring, a gas supply unit configured to supply gas from a lower side of the gap to an upper side of the gap, and an upper electrode provided above the stage.

Substrate processing apparatus and substrate processing method

A printer includes a printer body () including a recording-paper holder () that holds rolled recording paper () and includes a holder guide () for guiding the recording paper (), a platen roller (), a print head () attached to the printer body (), and a lower guide () that is disposed to face the holder guide () such that a conveying path for guiding the recording paper () is formed between the lower guide () and the holder guide ().

Printer

Growing community of inventors

Tokyo, Japan

Yukihiro Mori