Ebara Corporation

Ebara Refrigeration Equipment & Systems Co., Ltd.

Ckd Corporation

Yukihiro Fukusumi

Toshiharu Nakazawa

Naoyuki Inoue

Masayuki Kouketsu

Akihiro Ito

Isahiro Hasegawa

Norio Kokubo

Keisuke Takanashi

Kiichi Irie

Hiromasa Miyata

Kazutomo Miyazaki

Naoya Hanafusa

Motoshi Kohaku

Nobutaka Bannai

Ken Taoka

A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; an abatement device configured to detoxify the processing gas discharged from the vacuum pump; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a first downstream line, a second downstream line, and a third downstream line configured to supply the cooling liquid that has passed through the abatement device, the vacuum pump, and the cooling unit to the heating unit.

Subfab area installation apparatus

A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.

A temperature control system is used for controlling a temperature of a control target to a target temperature that changes with lapse of time. The system includes: a first adjustment apparatus that includes a first tank that stores a first heat transfer medium, adjusts the temperature of the first heat transfer medium to a first set temperature, and supplies the temperature-adjusted first heat transfer medium; a first circulation circuit through which the first heat transfer medium flows from the first adjustment apparatus to a first flow-through path and returns to the first adjustment apparatus; an adjustment section that adjusts an amount of heat supplied from the first flow-through path to the control target; a memory that stores a relation between the lapse of time and the target temperature; and a controller.

Temperature control system

A temperature control system is used for controlling a temperature of a control target. The system includes: a first circulation circuit through which a first heat transfer medium circulates; a second circulation circuit that is independent of the first circulation circuit and through which a second heat transfer medium circulates; and a third circulation circuit that is independent of the first circulation circuit and the second circulation circuit and through which a third heat transfer medium circulates. The third heat transfer medium has a usable temperature range wider than usable temperature ranges of the first heat transfer medium and the second heat transfer medium.

Temperature control system and integrated temperature control system

A cooling system includes: a first cooling apparatus electrically driven to supply a first heat transfer medium cooled to a first set temperature or lower; a plurality of second cooling apparatuses each of which includes a heat exchanger that exchanges heat between the first heat transfer medium supplied from the first cooling apparatus and a second heat transfer medium, and is electrically driven to supply a third heat transfer medium cooled to a second set temperature or lower, the second set temperature being changed individually with lapse of time; and a processor that obtains second set temperatures of the second cooling apparatuses and sets the first set temperature based on the obtained second set temperatures.

Cooling system that comprises multiple cooling apparatus and reduces power consumption

An absorption heat pump, including: an evaporator which takes in a first heat source and evaporates refrigerant liquid into refrigerant vapor; an absorber which has a heat receiving medium passage and which takes in heat receiving medium liquid through a heat receiving medium inlet of the heat receiving medium passage, heats the heat receiving medium liquid with the heat of absorption generated when the refrigerant vapor generated in the evaporator is absorbed into solution, and discharges the heat receiving medium in the form of vapor or mixture of vapor and liquid through a heat receiving medium outlet of the heat receiving medium passage; a generator which takes in a second heat source and evaporates the refrigerant from the solution having absorbed the refrigerant vapor; and a condenser which takes in a cooling source and the refrigerant vapor generated in the generator to condense the refrigerant vapor.

Absorption heat pump

To provide a highly efficient and compact absorption refrigerating machine with water heated from 60 to 70 degrees Celsius as the heat source. In an absorption refrigerating machine including a regenerator G, condenser C, an absorber A, an evaporator E, an auxiliary regenerator GX and an auxiliary absorber AX, the concentrated solution from G is heated and further concentrated in GX, while the diluted solution from A is cooled in AX, the refrigerant vapor from GX is absorbed. A low temperature heat exchanger XL is provided for heat exchange between the concentrated solution supplied from GX to A, and the diluted solution sent from AX to G, and a high temperature heat exchanger XH is provided for heating the diluted solution leaving from XL and sent to G with the concentrated solution supplied from G to GX.

Growing community of inventors

Tokyo, Japan

Yukihiro Fukusumi