Lam Research Corporation

Yuk-Hong Ting

David Wingto Cheung

Haoquan Fang

Systems and methods for reducing copper contamination in a substrate processing system include performing a plasma process on a substrate in a processing chamber of a substrate processing system. A component is located in the processing chamber and is made of an alloy including copper. The plasma process uses a process gas mixture including molecular hydrogen. Prior to performing the plasma process on the substrate and before the substrate is arranged in the processing chamber, the component is conditioned in the processing chamber using a conditioning plasma process that includes a process gas mixture including molecular oxygen and forming gas.

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Fremont, CA, United States of America

Yuk-Hong Ting