Hitachi, Ltd.

Hitachi-high-technologies Corporation

Hitachi High-tech Corporation

Nec Corporation

Hitachi High-thecnologies Corporation

Yuji Takagi

Chie Shishido

Maki Tanaka

Takehiro Hirai

Minoru Harada

Ryo Nakagaki

Masahiro Watanabe

Takashi Hiroi

Hisae Shibuya

Toshifumi Honda

Hirohito Okuda

Shunji Maeda

Kenji Obara

Yasuhiko Ozawa

Seiji Isogai

Asahiro Kuni

Yohei Minekawa

Yukio Matsuyama

Naoaki Kondo

Hiroyuki Shinada

Mari Nozoe

Aritoshi Sugimoto

Hideaki Doi

Minoru Yoshida

Yukihiro Shibata

Kenji Oka

Kazuo Yamaguchi

Atsushi Yoshida

Fumihiko Fukunaga

Minori Noguchi

Makoto Ono

Hidetoshi Morokuma

Toshiei Kurosaki

Atsushi Shimoda

Yuichi Hamamura

Yasunori Goto

Akira Hamamatsu

Atsushi Miyamoto

Takanori Ninomiya

Yasutaka Toyoda

Kenji Watanabe

Yuko Otani

Seiji Hata

Takuma Yamamoto

Takafumi Okabe

Naoki Hosoya

Hiroshi Kakibayashi

Hisafumi Iwata

Takuo Tamura

Junko Konishi

Shuji Maeda

Yasunari Souda

Takahiro Nishihata

Yoko Ikeda

Eiji Takada

Koji Arai

Ichirou Ishimaru

Yuri Mashimo

Hironori Nakata

Hiroki Naoshima

Mitsugu Sato

Makoto Suzuki

Hideyuki Kazumi

Kazuo Aoki

Yasuhiro Yoshitake

Koichi Hamada

Shunichi Matsumoto

Hiroyuki Kobayashi

Osamu Komuro

Hiroshi Miyai

Ryo Miyake

Mineo Nomoto

Takashi Iizumi

Shigeyuki Hosoki

Michio Hatano

Masashi Sakamoto

Yoshinori Momonoi

Junzou Azuma

Katsuhiko Ichinose

Kuniyasu Nakamura

Shinya Yamada

Mayuka Osaki

Yoshimasa Ooshima

Hirohiko Kitsuki

Kazuhisa Hasumi

Yutaka Tandai

Koichi Hayakawa

Hisae Yamamura

Tsunehiro Sakai

Yasuhiro Ozawa

Kazunori Nemoto

Daisuke Katsuta

Takashi Nobuhara

Miyuki Fukuda

Yuya Isomae

Nobuhiko Kanzaki

Tamao Ishikawa

Hideki Nakayama

An ambulance service support device receives biological information to be used for personal identification of a person to be transported. The ambulance service support device identifies, using a database storing personal medical information, the personal medical information of the person to be transported by using the acquired biological information. The personal medical information is personal information regarding medical care including the biological information. The ambulance service support device outputs emergency support information obtained from the identified personal medical information.

Ambulance service support device, ambulance service support method, and program storage medium

In learning processing performed before sample observation processing (steps Sto S), the sample observation device acquires a low-picture quality learning image under a first imaging condition for each defect position indicated by defect position information, determines an imaging count of a plurality of high-picture quality learning images associated with the low-picture quality learning image for each defect position and a plurality of imaging points based on a set value of the imaging count, acquires the plurality of high-picture quality learning images under a second imaging condition (step S), learns a high-picture quality image estimation model using the low-picture quality learning image and the plurality of high-picture quality learning images (step S), and adjusts a parameter related to the defect detection in the sample observation processing using the high-picture quality image estimation model (step S).

Sample observation device and method

A method, an apparatus, and a program for more appropriately determining a condition for appropriately recognizing a semiconductor pattern are provided. A method for determining a condition related to a captured image of a charged particle beam apparatus including: acquiring, by a processor, a plurality of captured images, each of the captured images being an image generated by irradiating a pattern formed on a wafer with a charged particle beam, and detecting electrons emitted from the pattern, each of the captured images being an image captured according to one or more imaging conditions, the method further including: acquiring teaching information for each of the captured images; acquiring, by the processor, one or more feature determination conditions; calculating, by the processor, a feature for each of the captured images based on each of the feature determination conditions, at least one of the imaging condition and the feature determination condition being plural.

Method, apparatus, and program for determining condition related to captured image of charged particle beam apparatus

A control device acquire person information that is information unique to person, specify ability information that is information indicating ability of the person indicated by the acquired person information, and output the specified ability information to a predetermined output device.

Control device, control method, and recording medium

A charged particle beam deviceincludes: a plurality of detectorsfor detecting a signal particleemitted from a sampleirradiated with a charged particle beamand converting the detected signal particleinto an output electrical signal; an energy discriminatorprovided for each detectorand configured to discriminate the output electrical signalaccording to energy of the signal particle; a discrimination control blockfor setting an energy discrimination condition of each of the energy discriminators; and an image calculation blockfor generating an image based on the discriminated electrical signal. The discrimination control blocksets energy discrimination conditions different from each other among the plurality of energy discriminators

Charged particle beam device

The invention is to provide a defect detection device capable of using a compact optical system to detect a plurality of types of defects with high sensitivity and high speed. The defect detection device includes an irradiation system that irradiates light onto an object to be inspected; an optical system that forms scattered light produced by a light irradiation into an image; a microlens array disposed at an image plane of the optical system; an imaging element that is disposed at a position offset from the imaging plane of the optical system and that images light that passes through the microlens array; a mask image storage unit that stores a plurality of mask images generated for each type of defect or each defect direction; and a calculation unit that carries out mask processing on an image obtained from the imaging element using the plurality of mask images and carries out defect detection processing.

Defect detection device, defect detection method, and defect observation device

A sample observation device images a sample placed on a movable table by irradiating and scanning the sample with a charged particle beam of a microscope. A degraded image having poor image quality and a high quality image having satisfactory image quality which are acquired at the same location of the sample by causing the charged particle microscope to change an imaging condition for imaging the sample are stored. An estimation process parameter is calculated for estimating the high quality image from the degraded image by using the stored degraded image and high quality image. A high quality image estimation unit processes the degraded image obtained by causing the charged particle microscope to image the desired site of the sample by using the calculated estimation process parameter. Thereby, the high quality image obtained at the desired site is estimated, and then the estimated high quality image is output.

Sample observation device and sample observation method

A defect observation device comprising: a defect determination coordinate creation unit by which the coordinates of a plurality of second defect candidates are determined as overlapping defect candidate coordinates, the plurality of second defect candidates respectively having, in a plurality of second imaging visual field regions overlapping a first imaging visual field region, a circuit pattern which partly overlaps a circuit pattern in the first imaging visual field region, in which a first defect candidate for defect determination among a plurality of defect candidates of a sample is present; a pseudo-reference image generation unit which generates a pseudo-reference image including a circuit pattern of the first defect candidate by superimposing a plurality of images respectively captured at the plurality of overlapping defect candidate coordinates; and a defect determination unit which compares an image for defect determination captured at the coordinates of the first defect candidate with the pseudo-reference image to determine the presence or absence of a defect in the image for defect determination.

Defect observation device and defect observation method

An overlay measurement method using a reference image is an effective method for an overlay measurement in a product circuit. However, there is a problem that it is not possible to obtain an ideal reference image in a process of prototyping. A measurement device described in a specific embodiment of the present invention includes an imaging unit that captures an image of a circuit pattern of a semiconductor wafer surface by an optical microscope or an electronic microscope, a pattern recognition unit that extracts a first pattern and a second pattern from the image captured by the imaging unit, a reference image generation unit that synthesizes a first reference image using the first pattern extracted from a plurality of the images and synthesizes a second reference image using the second pattern extracted from the plurality of images, a quantification unit that quantifies a first difference that is a difference between the first reference image and the first pattern and a second difference that is a difference between the second reference image and the second pattern, and a calculation unit that calculates an overlay amount included in the circuit pattern using the first difference and the second difference.

Measurement device, method and display device

A versatile template generation unit cuts a first region in which a similarity level to a template image is a first similarity level and a second region in which the similarity level to the template image is a second similarity level different from the first similarity level, from an input image including an alignment mark, to generate a versatile template image.

Wafer observation device

In a device for observing a semiconductor wafer, a positional relationship between an in-wafer region and a background region in an imaging field of view is not constant when an outer peripheral portion of the wafer is imaged, which results in an increase in the quantity of calculation in defect detection and image classification processing and makes it difficult to efficiently perform defect observation and analysis. There is provided a defect observation system for a semiconductor wafer, and the system includes: a stage on which the semiconductor wafer is placed and which is movable in an XY direction, an imaging unit that is configured to image a portion including an edge of the semiconductor wafer, and an image output unit that is configured to, with respect to a plurality of images obtained by imaging, output images in which edges of the wafer are substantially in parallel among the plurality of images.

Defect observation system and defect observation method for semiconductor wafer

Provided is a defect classification apparatus classifying images of defects of a sample included in images obtained by capturing the sample, the apparatus including an image storage unit for storing the images of the sample acquired by an external image acquisition unit, a defect class storage unit for storing types of defects included in the images of the sample, an image processing unit for extracting images of defects from the images from the sample, processing the extracted images of defects and generating a plurality of defect images, a classifier learning unit for learning a defect classifier using the images of defects of the sample extracted by the image processing unit and data of the plurality of generated defect images, and a defect classification unit for processing the images of the sample by using the classifier learned by the classifier learning unit, to classify the images of defects of the sample.

Defect classification apparatus and defect classification method

A method for measuring overlay at a semiconductor device on which circuit patterns are formed by a plurality of exposure processes is characterized in including an image capturing step for capturing images of a plurality of areas of the semiconductor device, a reference image setting step for setting a reference image based on a plurality of the images captured in the image capturing step, a difference quantifying step for quantifying a difference between the reference image set in the reference image setting step and the plurality of images captured in the image capturing step, and an overlay calculating step for calculating the overlay based on the difference quantified in the difference quantifying step.

Method for measuring overlay and measuring apparatus, scanning electron microscope, and GUI

A defect observation device detects a defect with high accuracy regardless of a defect size. One imaging configuration for observing an observation target on a sample is selected from an optical microscope, an optical microscope, and an electron microscope, and an imaging condition of the selected imaging configuration is controlled.

Defect observation device

An electron microscope device includes: a first detection means disposed at a high elevation angle for detecting electrons having relatively low energy; a second detection means disposed at a low elevation angle for detecting electrons having relatively high energy; a means for identifying, from a first image obtained from a first detector, a hole region in a semiconductor pattern within a preset region; a means for calculating for individual holes, from a second image obtained from a second detector, indexes pertaining to an inclined orientation and an inclination angle, on the basis of the distance between the outer periphery of the hole region and the hole bottom; and a means for calculating, from the results measured for the individual holes, indexes pertaining to an inclined orientation of the hole and an inclination angle of the hole as representative values for the image being measured.

Electron microscope device and inclined hole measurement method using same

Growing community of inventors

Kamakura, Japan

Yuji Takagi