Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Tokyo Electron Saga Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Saga Kabushiki Kaisha

Toktyo Electron Limited

Yuji Kamikawa

Naoki Shindo

Kinya Ueno

Koji Egashira

Satoshi Nakashima

Shigenori Kitahara

Takayuki Toshima

Mikio Nakashima

Miyako Yamasaka

Hiroshi Tanaka

Osamu Kuroda

Koukichi Hiroshiro

Tsukasa Watanabe

Kyouji Kohama

Norihiro Ito

Hiroki Ohno

Koji Tanaka

Teruomi Minami

Tadashi Iino

Mitsuo Nishi

Takafumi Tsuchiya

Shinichiro Shimomura

Takahiro Furukawa

Kouji Egashira

Hideyuki Tsutsumi

Osamu Tsuda

Eiji Shimbo

Tsuyoshi Nomura

Kenji Soejima

Satoshi Kaneko

Takehiko Orii

Mitsuaki Iwashita

Jiro Higashijima

Shinya Ishikawa

Shuichi Nagamine

Noriyuki Anai

Hiroaki Inadomi

Takami Satoh

Yoshihiro Kai

Koji Harada

Hironobu Hyakutake

Hiroki Taniyama

Hiroshi Komiya

Takayuki Tomoeda

Kotaro Tsurusaki

Tatsuya Nishida

Hirofumi Shiraishi

Shinya Murakami

Sadayuki Fujishima

Akira Koguchi

Eiichi Mukai

Sinichiro Izumi

Masaki Taira

Kazuyuki Honda

Kazuhiko Kobayashi

Hideyuki Yamamoto

Nobutaka Kuroda

Shori Mukuo

Taichi Sakaguchi

Masafumi Inoue

Masahiro Noda

A nozzle cleaning device is capable of uniformly cleaning a nozzle from a front end of the nozzle to an upper part thereof. The nozzle cleaning device includes a storage tank, a liquid discharging portion and an overflow discharging portion. The storage tank has a cylindrical inner peripheral surface and is configured to store therein a cleaning liquid that cleans a nozzle used in a substrate process. The liquid discharging portion is configured to discharge the cleaning liquid into the storage tank toward a position eccentric with respect to a central axis of the cylindrical inner peripheral surface to store the cleaning liquid within the storage tank and configured to form a vortex flow of the cleaning liquid revolving within the storage tank. The overflow discharging portion is configured to discharge the cleaning liquid that overflows the storage tank.

Nozzle cleaning device, nozzle cleaning method, and substrate processing apparatus

The present invention provides a substrate cleaning method capable of removing particles from the entire surface of a substrate to be processed at a high removing efficiency. In the substrate cleaning method according to the present invention, a substrate to be processed W is immersed in a cleaning liquid in a cleaning tank. Then, ultrasonic waves are generated in the cleaning liquid contained in the cleaning tank, so that the substrate to be processed W is subjected to an ultrasonic cleaning process. While the substrate to be processed is being cleaned, a dissolved gas concentration of a gas dissolved in the cleaning liquid contained in the cleaning tank is changed.

Substrate cleaning method, substrate cleaning system and program storage medium

A substrate processing apparatus, which utilizes a first transfer apparatus and a second transfer apparatus which are configured to transfer a transfer container containing a plurality of substrates, along a first transfer path and a second transfer path whose lateral positions differ from each other, respectively, including a first load port where the transfer container is loaded and unloaded by the first transfer apparatus, and a second load port that is arranged stepwise with respect to the first load port, with the transfer container being loaded to and unloaded from the second load port by the second transfer apparatus.

Substrate processing apparatus

Disclosed is a substrate processing apparatus including a processing vessel in which a target substrate W is processed by using a high-pressure fluid in a supercritical state or a subcritical state, and pipes that are divided into a first pipe member and a second pipe member in a flowing direction of the fluid and circulate the fluid are connected to processing vessel. A connecting/disconnecting mechanism moves at least one of first and second pipe members between a connection position and a separation position of first pipe member and the second pipe member, and opening/closing valves are installed in each of first and second pipe members and are closed at the time of separating pipe members.

Substrate processing apparatus, substrate processing method, and storage medium

Disclosed are an evaporator, an evaporation method, and a substrate processing apparatus, which can increase the concentration of generated vapor of an organic solvent and efficiently heat the organic solvent. The evaporator includes a fluid tube, a liquid organic solvent supply device for supplying the organic solvent liquid to one end of the fluid tube, and heating units for heating the fluid tube. The fluid tube has a cross section that increases from the one end to the other end. When the organic solvent liquid supplied to one end of the fluid tube is heated, the organic solvent vapor is discharged from the other end of the fluid tube. The substrate processing apparatus includes the above-described evaporator.

Evaporator, evaporation method and substrate processing apparatus

Disclosed is a substrate processing apparatus capable of drying a substrate to be processed while suppressing the pattern collapse or the occurrence of contamination. A substrate is held in a liquid bath while being immersed in a liquid, and the liquid bath is disposed in a processing space of a processing vessel. A processing of drying the substrate is performed by replacing the liquid in the liquid bath with a supercritical-state fluid. A predetermined mechanism moves liquid bath between a processing location in the processing case and a stand-by location outside the processing case. A heater installed in the processing case changes the fluid to a supercritical state or maintains the supercritical state while cooling mechanisms cool down the liquid bath moved to the stand-by location outside the processing vessel.

Disclosed is a substrate processing apparatus capable of drying a substrate to be processed while suppressing a pattern collapse or occurrence of contamination. In a processing vessel, a substrate is immersed in a liquid in the longitudinal direction, and the liquid is pushed out by a substitution fluid of a supercritical state to be discharged from the processing vessel. Thereafter, the substitution fluid subjected to the substitution with the liquid is discharged from the processing vessel to depressurize the processing vessel, and the substitution fluid is changed from the supercritical state to a gaseous state to dry the substrate.

Substrate processing apparatus, substrate processing method and storage medium

A processing apparatus is provided for enhancing throughput in the manufacture of semiconductor wafers and/or liquid crystal substrates, by reducing the time required for performing a rinsing process. A position of an object to be processed is controlled, such that a distance between the surface position of a rinsing liquid upon the rinsing process and a top end position of the object to be processed becomes shorter than a distance between the surface position of a chemical liquid upon a chemical liquid process and the top end position of the object to be processed. Alternatively, the position of the object to be processed is controlled, such that the distance between the surface position of the rinsing liquid upon the rinsing process and the top end position of the object to be processed becomes shorter than a distance between the bottom face position of the rinsing liquid and a bottom end position of the object to be processed.

Liquid processing apparatus, liquid processing method, computer program, and storage medium

An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.

Ultrasonic cleaning apparatus, ultrasonic cleaning method, and storage medium storing computer program for executing ultrasonic cleaning method

A liquid processing apparatus includes: a processing partconfigured to process an object to be processed by a process liquid; a supply pathconnected to the processing partthe supply pathbeing configured to guide the process liquid to the processing parta solvent supply partconfigured to supply a solvent to the supply pathand a chemical-liquid supply partconfigured to supply a chemical liquid to the supply paththrough a chemical-liquid supply path so as to generate a chemical liquid diluted with the solvent. A measuring partwhich is configured to measure a conductivity of the chemical liquid diluted with the solvent, is disposed in the supply path at a position downstream from a connection points, to which the chemical-liquid supply pathis connected. An additional chemical-liquid supply part, which is configured to supply an additional chemical liquid different from the chemical liquid through an additional chemical-liquid supply path, is connected to the supply path at a position downstream from a measuring pointon which the measuring partis disposed.

Liquid processing apparatus and process liquid supplying method

A liquid processing apparatuscomprises a casing, a substrate holding mechanismthat holds a wafer (substrate to be processed) W, a process-liquid supplying mechanismthat supplies a process liquid, a draining cupthat receives a process liquid, and a draining pipethat discharges a process liquid outside. The process-liquid supplying mechanismincludes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control partcauses the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control partcauses the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanismto remove an alkaline component in a casing

Liquid processing apparatus, liquid processing method, and storage medium

Disclosed is a substrate processing apparatus for cleaning and drying a substrate such as a semiconductor wafer. This substrate processing apparatus includes a liquid processing unit for processing a substrate by immersing the substrate in stored purified water, a drying unit arranged above the liquid processing unit and configured to dry the substrate, a substrate transfer apparatus for transferring the substrate between the liquid processing unit and drying unit, a fluid supply mechanism for supplying a fluid mixture containing vapor or mist of purified water and vapor or mist of a volatile organic solvent to the drying unit, and a controller for controlling the supply of the fluid mixture.

Substrate processing method and non-transitory storage medium for carrying out such method

Growing community of inventors

Tosu, Japan

Yuji Kamikawa