Canon Anelva Corporation

Yuichi Sasuga

Masami Shibagaki

Hiroshi Doi

Nobuyuki Masaki

A heat treatment apparatus including a vacuum vessel, a substrate stage which holds a substrate mounted on it, a heating unit for heating the substrate, and an exhaust unit for evacuating the vacuum vessel includes a first reflector which covers the upper portion of the exhaust port of the exhaust unit while being spaced apart from the exhaust port, and a second reflector which surrounds the exhaust port. At least one of reflector members which form the second reflector faces a direction defined from the heating unit to the exhaust port.

Heat treatment apparatus and semiconductor device manufacturing method

A substrate processing apparatus includes a chamber capable of being evacuated, a substrate stage adapted to mount a substrate, a heating unit adapted to be set above the substrate mounting surface of the substrate stage, face the substrate mounted on at least the substrate mounting surface, and heat the substrate by radiant heat without being in contact with the substrate, a shutter adapted to be retractably inserted in the space between the heating unit and the substrate mounted on the substrate mounting surface, and a shutter driving unit adapted to extend/retract the shutter into/from the space. The substrate is mounted on the substrate stage to face the heating unit, the substrate is annealed by heating the substrate by radiant heat from the heating unit, and the shutter is extended into the space between the heating unit and the substrate stage.

Substrate processing apparatus, substrate annealing method, and semiconductor device manufacturing method

Deterioration of an O ring due to radiation heating in a vacuum heating apparatus is prevented to allow heat treatment of a substrate with good annealing properties. The vacuum heating apparatusincludes a vacuum chamberconstituted by flangesandhaving an opening portionand joined together, a turbo molecular pumpfor exhausting gas from the vacuum chamber, and a heater basefor heating a substrateplaced in the vacuum chamber. Joint surfaces of the flangesandare sealed by an O ring. Further, bonding stepsare formed between the heater baseand the O ringon the joint surfaces of the flangesand, thereby preventing thermo-radiation from the heater basefrom reaching the O ringthrough the joint surfaces of the flangesand

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Minamitsuru-gun, Japan

Yuichi Sasuga