Nissan Motor Company Limited

Nippon Steel Corporation

Sumitomo Bakelite Company Limited

Yui Takahashi

Hiroshi Sato

Hiroshi Yoshida

Yohei Kato

Yoshinori Murakami

Kazuhiro Mitamura

Shinji Sato

Katsushi Yamashita

Junichiro Suzuki

Fumiki Kato

Daisuke Yasufuku

Hidekazu Tanisawa

Susumu Yuasa

A subframe () includes a base member () and a first member (). The base member () is a channel-shaped member that includes a base surface portion () and two wall portions () on both sides of the base surface portion () in a vehicle length direction and is open on its lower side in a vehicle height direction. The first member () includes a bottom wall portion (), a top wall portion (), and a side wall portion (). The bottom wall portion () and the top wall portion () are disposed in the same direction as the base surface portion (). The top wall portion () is overlapped on and joined to the base surface portion (). The wall portions () and the bottom wall portion () form the channel shape. The side wall portion () is a wall that blocks a vehicle width direction between the bottom wall portion () and the top wall portion (). A first lower arm support portion () is formed by the base surface portion () and the bottom wall portion ().

Subframe

A semiconductor device includes a semiconductor chip provided inside with a p-n junction, an opaque sealing resin covering a surface of the semiconductor chip, and a functional region arranged between the semiconductor chip and the sealing resin and configured to prevent light, which is generated when a forward current flows through the p-n junction and has a particular wavelength causing deterioration of the sealing resin, from reaching the sealing resin.

Semiconductor device

Provided is a resin composition for encapsulation used for encapsulating a power semiconductor element formed from SiC, GaN, GaO, or diamond, the resin composition for encapsulation including a thermosetting resin (A) and silica (B), in which the silica (B) includes Fe, the content of Fe is equal to or less than 220 ppm with respect to the total amount of the silica (B), and the resin composition is in a granular form, a tablet form, or a sheet form.

Resin composition for encapsulation, and semiconductor device

Growing community of inventors

Tokyo, Japan

Yui Takahashi