Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Sen Chu

Chih-Hao Wang

Carlos H Diaz

Mu-Chi Chiang

Ching-Yu Huang

Kuo-Hung Liao

Chien-Jiun Wang

Chao-Jie Tsai

Su-Yu Lu

A method of forming an implanted pocket region, to reduce short channel effects (SCE), for narrow channel length, NMOS devices, has been developed. After forming an initial indium pocket region, with an initial indium profile, in the area of a P type semiconductor to be used to accommodate an N type source/drain region, a low temperature anneal procedure is used to activate indium ions in the initial indium pocket region, and to create a final indium pocket region, featuring a final indium profile. The final indium profile remains unchanged after experiencing subsequent high temperature procedures, such as a post-heavily doped, source/drain anneal. The narrow channel length NMOS devices, fabricated using the low temperature anneal procedure described in this invention, resulted in a reduced Vt roll-off phenomena, when compared to counterpart, narrow channel length NMOS, formed without the benefit of the low temperature anneal procedure.

Method of forming an indium retrograde profile via use of a low temperature anneal procedure to reduce NMOS short channel effects

An apparatus and a method for oxidizing silicon substrates by either a wet oxidation or a dry oxidation process in the same oxidation chamber are provided. In the apparatus, an additional conduit is provided for evacuating any residual water vapor trapped in a conduit section between an external torch and the oxidation chamber such that residual water vapor does not flow into the oxidation chamber and cause problems for a dry oxidation process subsequently conducted. The present invention novel apparatus therefore allows thin silicon oxide films such as those used in gate oxides to be formed with high quality in the same oxidation chamber. The present invention novel apparatus further allows high quality tri-layered silicon oxide films to be formed in a dry-wet-dry oxidation process for achieving satisfactory deposition rates and high quality oxide films on the substrate. The present invention novel apparatus and method further allows the same oxidation chamber to be used in a dry oxidation process immediately following a wet oxidation process.

Apparatus and method for oxidizing silicon substrates

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Kaohsiung, Taiwan

Yu-Sen Chu