Shinko Electric Industries Co., Ltd.

Yu Karasawa

Daisuke Takizawa

Sachiko Oda

Hiroaki Taniguchi

Ryo Miyazawa

A wiring board assembly includes a wiring structure and an insulating layer. The insulating layer covers a surface of the wiring structure and includes a slit that exposes a predetermined region on the surface of the wiring structure. An edge portion of the outermost insulating layer corresponding to the edge portion of the slit meanders in a wave-like manner.

Wiring board assembly, wiring board, and wiring board manufacturing method

A wiring substrate includes a first substrate including a wiring layer and a solder resist layer that partially covers the wiring layer. The solder resist layer includes a circular opening partially exposing the wiring layer and a support partially covering the wiring layer within the opening. The wiring layer includes a first connection pad exposed in the opening and formed by a portion of the wiring layer located at an outer side of the support. The wiring substrate further includes a cylindrical connection pin and a bonding member that bonds a first end surface of the connection pin and the first connection pad located in the opening.

Growing community of inventors

Nagano, Japan

Yu Karasawa