I-shou University

Yu-Jung Huang

Mei-Hui Guo

Ming-Kun Chen

Chung-Long Pan

Hsuan-Hsun Wu

Shih-Chun Lin

Chun-Wei Huang

Yan-Cen Liou

Tzu-Lun Yuan

Mong-Na Lo Huang

Kai-Jen Liu

A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.

Method and electronic device for configuring signal pads between three-dimensional stacked chips

A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Defect detection method for multilayer daisy chain structure and system using the same

The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal. The receiver receives the receiving-testing-coupling signal through the reception-metal-pad and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Chip-to-chip signal transmission system and signal reception circuit

A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

Defect detection method for 3D chip and system using the same

A chip-to-chip signal transmission system including a first unit set and a second unit set arranged in a first direction is provided. The first unit set and the second unit are configured to perform the signal transmission between a first chip and a second chip. There is a shift between the first unit set and the second unit set in a second direction such that the first unit set and the second unit set are shifted in the second direction and an overlapping region is formed. By adjusting the size of the overlapping region, the signal noise and the signal attenuation due to the misalignment between the first chip and the second chip or the electromagnetic interference of the adjacent signals are reduced and the signal transmission quality is thus improved. Furthermore, a method for arranging chips is also provided.

Chip-to-chip signal transmission system and method for arranging chips thereof

The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

Wireless sensor network and central node device thereof

A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Chip-to-chip signal transmission system and chip-to-chip capacitive coupling transmission circuit

A signal transmission system and a signal transmission circuit are provided. The system includes a first chip and a second chip. A rising pulse signal (RPS) and a falling pulse signal (FPS) are generated by a transmission module on the first chip in response to a waveform of an input signal. The RPS corresponds to rising edges of the input signal, the FPS corresponds to falling edges of the input signal, and the RPS and the FPS are transmitted by a first transmission unit and a second transmission unit both located on a surface of the first chip.

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Kaohsiung, Taiwan

Yu-Jung Huang