United Microelectronics Corp.

Yu-Chang Chow

Chia-Fu Yeh

Wen-Hua Cheng

W H Cheng

Hung-Chen Yu

Cobby Lee

Chih-Ming Chi

C M Chi

A process for cleaning the interior walls of a reaction chamber after a number of silicon wafers is etched inside the chamber. The cleaning process includes bombarding the interior walls of the chamber with a first type of plasma in a dry cleaning operation, and then bombarding the interior walls of the chamber with a second type of plasma containing the element hydrogen in a warm-up operation. No silicon wafers need to be placed inside the chamber when the dry cleaning operation or the warm-up operation is conducted.

Method for cleaning interior of etching chamber

A waferless seasoning process is described, which waferless seasoning process is suitable for an etching chamber of an etching machine when the etching environment is so bad that etching cannot be performed. A dry cleaning process with a plasma formed by oxygen and hydrogen bromide is performed to restore the etching environment in the etching chamber.

Waferless seasoning process

A method of fabricating a barrier layer includes a clamped metal layer formed on a substrate. After the formation of the clamped metal layer, a rapid thermal process is performed. A clampless metal nitride layer is then formed on the clamped metal layer.

Method of fabricating barrier layer in integrated circuit

Growing community of inventors

Hsinchu, Taiwan

Yu-Chang Chow