Qualcomm Incorporated

Young Uk Yim

Ashwin Sethuram

Satish Krishnamoorthy

Mostafa Naguib Abdulla

Chang Ki Kwon

Jacob Schneider

Prince Mathew

Mohammed Mizanur Rahman

Andrew Tohmc

An ESD protection circuit in an interface circuit has a first diode coupled between a first power source of an integrated circuit device and an input/output pad of the integrated circuit device, a second diode coupled between a second power source of the integrated circuit device and the input/output pad, and a resistive element that couples the second diode to the first diode and to the input/output pad. The first power source supplies a driver circuit coupled to the input/output pad. The second power source supplies one or more core circuits of the integrated circuit device. The resistive element may be implemented as an interconnect configured to provide a resistance that produces a voltage differential between a terminal of the second diode and a corresponding terminal of the first diode during an electrostatic discharge event.

Electrostatic discharge circuit for multi-voltage rail thin-gate output driver

A hybrid output data path is provided that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.

High-voltage and low-voltage data paths of a hybrid output driver

A hybrid output driver is disclosed that supports high-voltage signaling and low-voltage signaling. The high-voltage signaling is powered by a high-power supply voltage that is greater than a low-power supply voltage that powers the low-voltage signaling.

High-voltage and low-voltage signaling output driver

Growing community of inventors

San Diego, CA, United States of America

Young Uk Yim