Tokyo Ohka Kogyo Co., Ltd.

Tokyo Ohka Co., Ltd.

Yoshitsugu Kawamura

Akira Uehara

Tsukasa Sugawara

Mitsuaki Minato

Kaoru Ishikawa

Kazuto Obuchi

Mitsuharu Tobari

Hisashi Hori

Provided is a method for producing a porous polyimide film with which it is possible to suppress the occurrence of curling in the polyimide-fine particle composite film obtained by firing the unfired composite film. The method for producing a porous polyimide film of the present invention includes, in the following order: forming an unfired composite film using a varnish that contains a resin including polyamide acid and/or polyimide, fine particles, and a solvent; immersing the unfired composite film in a solvent including water; firing the unfired composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Method for producing porous polyimide film

For shortening the time for introducing an inactive gas, such as nitrogen gas, into a load lock chamber of a processing apparatus for substrates, a buffer tank 19 having a capacity larger than that of the load lock chamber 3 is provided in the path of a pipe for introducing the nitrogen gas into the load lock chamber 3 of the processing apparatus. During processing within the processing chamber 2, such as an ashing process and so on, the nitrogen gas is introduced into the load lock chamber 3 from the buffer tank 19 by operating a valve mechanism 21 to increase the pressure within the load lock chamber 3 up to atmospheric pressure.

Processing apparatus for substrates

A plasma processing apparatus for etching, ashing, or otherwise processing silicon wafers has a pair of spaced reaction chambers each for processing a silicon wafers in a plasma, a pair of spaced cassette table mechanisms each for supporting a wafer cassette which houses a plurality of wafers therein, and a transfer robot disposed between the pair of spaced reaction chambers and the pair of spaced cassette table mechanisms, for transferring the wafers, one at a time, between the wafer cassette supported by one of the workpiece table mechanisms and one of the reaction chambers. Each of the cassette table mechanisms has a turntable for placing the wafer thereon, the turntable being rotatable to orient the wafer cassette out of physical interference with the robot arm of the transfer robot.

Plasma processing apparatus

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Kanagawa, Japan

Yoshitsugu Kawamura