Tokyo Electron Limited

Yoshitaka Matsuda

Kiyomitsu Yamaguchi

Fumio Satou

Kiyohisa Tateyama

Kimio Motoda

Mitsuhiro Sakai

Hiroshi Hashimoto

Yoichi Honda

Takeshi Tsukamoto

Norio Uchihira

Noriyuki Anai

Hideyuki Takamori

Tetsuya Sada

Tetsu Kawasaki

Kengo Mizosaki

Masaaki Yoshida

A substrate coated with a coating solution, for example, a resist solution is heated at a predetermined temperature, thereafter putted in a non-heated state, and then heated at a second predetermined temperature. Alternatively, a heating process in which a substrate coated with a resist solution is heated and a non-heated process in which the substrate is putted in a non-heated state are repeated a plurality of times. The adoption of the above treating methods can prevent the occurrence of transfer which is an index of ununiformity of film thickness of a resist solution and the like and change in line width of a circuit pattern, thus improving yield in substrate treatment.

Substrate treating method

An apparatus for a treatment is provided, the apparatus comprising a vessel for recovering a treatment liquid flowing out or flying out when the object is treated, cleaning means for cleaning an inner wall surface of the vessel by supplying a cleaning liquid into the vessel, and a circulation system for recovering a discharged liquid discharged from the vessel when the inner wall surface of the vessel is cleaned by the cleaning means and supplying the recovered liquid to the cleaning means.

Method and apparatus for cleaning treatment

A cleaning unit for cleaning a substrate is disclosed, that comprises a holding mechanism for rotatably and horizontally holding the substrate, a first traveling means for holding both sides of a cleaning mechanism having at least one cleaning member and for moving the cleaning mechanism in such a manner that the first traveling means is kept in parallel with the substrate held by the holding mechanism, and a second traveling means for holding both sides of a processing solution supplying mechanism having supplying mechanisms for supplying different types of processing solution and for moving the cleaning mechanism in such a manner that the second traveling means is kept in parallel with the substrate held by the holding mechanism. Thus, the strength of the cleaning unit according to the present invention is higher than the strength of a conventional cleaning unit that holds an arm on one side thereof. In addition, a process of a cleaning mechanism and a process of a supplying mechanism can be equally performed on the entire surface of the substrate.

Substrate cleaning unit and cleaning method

Disclosed is a processing apparatus comprising holding means, support means, process solution supply means, life means, and rotating means. A substrate to be processed is rotatably held by the holding means. An overhanging portion of the substrate extending over an edge of the holding means is supported by the support means to maintain a front surface of the substrate horizontally flat. A process solution is supplied from the process solution supply means onto the front surface of the substrate held by the holding means and supported by the support means. The substrate held by the holding means is vertically moved by the lift means relative to the support means. Further, the substrate moved upward relative to the support means is rotated by the rotating means.

Apparatus and method for supplying process solution to surface of

The invention provides an apparatus for treating a substrate with resist, comprising a spin chuck for horizontally holding a substrate, a first motor for variably rotating the spin chuck, a nozzle for applying resist solution onto the upper surface of the substrate held on the spin chuck, a cup having an upper opening through which the substrate is put in or taken out of the cup and a lower opening through which extends the driving shaft of the spin chuck, the cup positioned to surround the substrate held on the spin chuck to receive liquid centrifugally separated from the substrate which is rotated about its axis, a lid to close the upper opening of the cup to define a space around the substrate, a second motor for variably rotating the cup independently of the spin chuck rotation, a liftable cylinder for relatively moving at least one of the spin chuck and cup, which are positioned apart from each other, toward each other to achieve mutual contact, and an O-ring for hermetically sealing the mutual contact portion between the cup and spin chuck when these cup and spin chuck are brought into mutual contact by the liftable cylinder. When the cup and spin chuck are brought into mutual contact by the liftable cylinder, the lower opening of the cup is closed by the spin chuck to form a hermetic space. The spin chuck and cup are rotated in synchronism by first and second motors while the chamber is kept hermetically closed.

Apparatus for treating a substrate with resist and resist-treating method

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Kumamoto-ken, Japan

Yoshitaka Matsuda