Shibaura Mechatronics Corporation

Yoshinao Kamo

Atsushi Fujita

Shigeki Matsunaka

Hisashi Nishigaki

Shohei Tanabe

Akihiko Ito

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method

A film formation apparatus includes a carrying unit circulating and carrying an electronic component in a sputtering chamber, a film formation processing unit including a mount surface and a mount member which is mounted on the mount surface, and on which the electronic component is placed. The mount member includes a holding sheet having an adhesive surface, and a non-adhesive surface, and a sticking sheet having a first sticking surface with adhesiveness sticking to the non-adhesive surface, and a second sticking surface with adhesiveness sticking to the mount surface of the tray. The adhesive surface includes a pasting region for pasting the electronic components. The first sticking surface sticks across an entire region of the non-adhesive surface corresponding to at least the pasting region to provide a file formation apparatus which employs a simple structure that is capable of suppressing heating of electronic components.

Film formation apparatus

An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic componentincludes an electromagnetic wave shielding filmformed on the top face of a package sealing elements. The thickness of the electromagnetic wave shielding filmon the top face of the packageis 0.5 to 9 &#x3bc;m, and the relationship between the average height Rc of the roughness curvature factor of the top face of the packageand the thickness Te of the electromagnetic wave shielding filmis Rc&#x2264;2Te.

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Yokohama, Japan

Yoshinao Kamo