Japan Synthetic Rubber Co., Ltd.

Jsr Corporation

Yoshihiro Hosaka

Yoshiyuki Harita

Ikuo Nozue

Masashige Takatori

Kunihiro Harada

Yoichi Kamoshida

Kiyoshi Honda

Yasuo Matsuki

Masayuki Endo

Hiroharu Ikeda

Eijiro Tagami

Mitsuo Kurokawa

Yosinobu Kariya

A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Radiation-sensitive resin composition

A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymono-carboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Radiation-sensitive resin composition utilizing monooxymonocarboxylic

A radiation-sensitive resin composition comprising a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monoxymono-carboxylic acid ester. This composition has a high storage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.

Method of pattern formation utilizing radiation-sensitive resin

Radiation-sensitive composition containing 1,2 quinonediazide compound,

Radiation-sensitive composition containing 1,2-quinonediazide compound,

1,2-quinonediazide containing radiation-sensitive resin composition

A positive type radiation-sensitive resin composition which comprises a 1,2-quinonediazide compound and an alkali-soluble novolac resin produced by poly-condensing phenols represented by the formulas (I) and (II) in a molar ratio of (I)/(II) of 1/99 to 100/0 with a carbonyl compound: ##STR1## wherein R.sup.1 and R.sup.2, which may be the same or different, represent hydroxyl groups, hydrogen atoms, alkyl groups, aryl groups, aralkyl groups, alkenyl groups, halogen atoms, alkoxy groups, alkoxycarbonyl groups, aroxycarbonyl groups, alkanoyloxy groups, aroyloxy groups, acyl groups, cyano groups or nitro groups, ##STR2## wherein R.sup.3, R.sup.4 and R.sup.5, which may be the same or different, represent hydrogen atoms, alkyl groups, aryl groups, aralkyl groups, alkenyl groups, halogen atoms, alkoxy groups, alkoxycarbonyl groups, aroxycarbonyl groups, alkanoyloxy groups, aroyloxy groups, acyl groups, cyano groups or nitro groups. The above positive type radiation-sensitive resin composition is excellent in dry-etching resistance, resolution and heat resistance, and appropriate as a positive type resist for producing integrated circuits in which a resist pattern is formed, and also as a positive type resist for producing a mask.

Positive type radiation-sensitive resin composition

A curable composition comprising (a) an amic acid compound and/or an imide compound each containing a silicon atom having at least one hydrolyzable group and (b) an organosilane compound represented by the formula (I): ##STR1## wherein R.sup.1 -R.sub.6, which may be the same or different, are alkyl groups of 1-10 carbon atoms or aryl groups of 6-10 carbon atoms. Said composition is suitably used for the formation of a protective film for a transparent substrate or a color filter in liquid crystal display devices.

Curable composition

A positive type photosensitive resin composition comprising an alkali-soluble novolac resin and (A) a compound represented by the following general formula (I) and a compound represented by the following general formula (II) or (B) a compound represented by the following general formula (III) and a compound represented by the following general formula (IV), wherein the molar ratio of the compound represented by the general formula (I) to the compound represented by the general formula (II) is 6/4-9/1 or the molar ratio of the compound represented by the general formula (III) to the compound represented by the general formula (IV) is 1/9-9/1 and the total amount of the component (A) or (B) is 5-100 parts by weight per 100 parts by weight of the alkali-soluble novolac resin: ##STR1## wherein R.sub.1, R.sub.5, R.sub.8 and R.sub.10, which may be identical or different, represent alkyl groups, aryl groups or aralkyl groups; and R.sub.2, R.sub.3, R.sub.4, R.sub.6, R.sub.7, R.sub.9, R.sub.11 and R.sub.12, which may be identical or different, represent 1,2-naphthoquinonediazide-4-sulfonyl groups, 1,2-naphthoquinonediazide-5-sulfonyl groups or 1,2-benzoquinonediazide-4-sulfonyl groups. Said positive type photosensitive resin composition is excellent in both sensitivity and yield of residual film thickness.

Positive type photosensitive resin composition with at least two

A photosensitive resin composition comprising a 1,2-quanonediazide compound and a copolymer consisting essentially of (A) a conjugated diolefinic compound, (B) a monoolefinically unsaturated compound and (C) an .alpha.,.beta.-ethylenically unsaturated carboxylic acid. Said composition can provide a positive type resist which is difficult to break and excellent in adhesion to a substrate.

Positive type photosensitive resin composition

A photosensitive resin composition comprising (I) a copolymer containing (A) 10 to 95 mol % of a conjugated diolefinic hydrocarbon, (B) 5 to 90 mol % of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid and (C) 0 to 85 mol % of a monoolefinically unsaturated compound, (II) a photosensitizer and/or a photosensitive crosslinking agent, and, if necessary, (III) a photopolymerizable unsaturated monomer. Said copolymer may have been reacted with an inorganic alkali, an alkali salt or an amine compound in a proportion of 0.05 to 1.0 equivalent per equivalent of the carboxyl group of the .alpha.,.beta.-ethylenically unsaturated carboxylic acid in said copolymer. This photosensitive resin composition is excellent in storage stability, quick in photosetting upon exposure to actinic light rays including ultraviolet rays, that is, high in sensitivity, capable of development with water or a dilute aqueous alkaline solution and possesses satisfactory rubber elasticity, and a printing plate formed from the composition is excellent in water resistance though the composition is developable with an aqueous developing solution, so that the composition can be used for a flexographic printing plate, to which an aqueous flexographic printing ink can be applied. Said composition can also be used for a pohote-resist which is high in sensitivity, developable with water or a dilute alkaline solution and excellent in resolving power.

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Yokohama, Japan

Yoshihiro Hosaka