Kabushiki Kaisha Toshiba

Yoshiaki Hattori

Takayuki Abe

Takashi Kamikubo

Tomohiro Iijima

Hirohito Anze

Susumu Oogi

Mitsuko Shimizu

Takashi Saito

Toru Tojo

Noriaki Nakayamada

Hideo Inoue

Hitoshi Higurashi

Kazuto Matsuki

Eiji Murakami

Shigeru Kanemoto

Ichiro Tai

Akio Arakawa

Hideyuki Tsurumaki

Riyoko Haneda

A pattern writing method acquires the area of a pattern segment located in each of a plurality of small regions obtained by dividing a region on which a pattern is to be written, small region by small region, and writes a pattern based on an optimum dose calculated based on this area. This method employs a scheme of shifting pattern segments and averaging the accumulated area, so that even when the pitch of repetitive patterns slightly differs from the side length of each small region in the pitch direction, a peculiar error does not occur, thereby ensuring highly-precise proximity effect correction and contributing to improving the precision of writing an LSI pattern.

Pattern writing method

A charged beam lithography system includes a charged particle gun for generating charged beams, a main deflecting system and a sub-deflecting system for deflecting the charged beams generated by the charged particle gun, and a control computer. The charged beam lithography system is designed to cause the surface of a substrate to be irradiated with the charged beams from the charged particle gun while continuously moving a stage, to write a desired pattern for each of stripes defined by the maximum deflection widths of the main deflecting system and the sub-deflecting system. The charged beam lithography system further comprises: a real time proximity effect correcting circuit for calculating an optimum dosage for each of the stripes by correcting the dosage of the electron beams in view of the influence of the proximity effect; and a cash memory for storing the optimum dosage data for at least two of the stripes. Thus, the charged beam lithography system is designed to shift a divided form of the whole written region using the stripes at each wiring number of times, by a predetermined distance from a predetermined reference position in a direction perpendicular to a stage continuous moving direction, while selectively extracting the optimum dosage data from the cash memory so as to correspond to each of written stripes at each writing number of times, to write patterns. During the writing operation, the optimum dosage data corresponding to the next region to be written are transferred from the real time proximity effect correcting circuit to the cash memory, and the real time proximity effect correcting circuit calculates optimum dosages for the stripes corresponding to regions to be written after next and thereafter.

Charged beam lithography system

A method for monitoring equipment state by distribution measurement data comprises: the steps of momentarily taking in two-dimensional distribution measurement data relating to the state of equipments including an equipment to be monitored; allowing the two-dimensional distribution measurement data and a display result by a three-dimensional shape model of the equipment to be monitored to undergo positioning and carrying out overlaid display in such a manner that they are caused to correspond to each other; designating an equipment portion to be inspected from the display content; allowing measurement data of the equipment to be monitored to undergo mapping onto the three-dimensional shape model corresponding to the designated equipment portion; and detecting changes in the measurement data to judge presence or absence of unusual condition of the equipment. Moreover, an equipment state monitoring apparatus comprises: a distribution measurement unit for measuring distribution of temperature, vibration or sound, etc. at the plant equipment surface; a distribution measurement image data positioning unit for determining position and direction of the distribution measurement unit in order to allow distribution measurement image data from the distribution measurement unit to undergo positioning so that it is in correspondence with a projection chart of a corresponding plant equipment spatial shape model; a texture-mapping unit for allowing the distribution measurement image data to undergo texture-mapping onto the surface of the spatial shape model of the plant equipment on the basis of the position and the direction of the measurement unit determined by the distribution measurement image data positioning unit; a projecting unit for describing a projection chart of the texture-mapped plant equipment spatial shape model; and an image display unit for displaying the projection chart from the projecting unit.

Method for monitoring equipment state by distribution measurement data,

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Tokyo, Japan

Yoshiaki Hattori