Phicom Corporation

Yong-Hwi Jo

Ki-Joon Kim

Han-Moo Lee

Sung-Young Oh

Jun-Tae Hwang

In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules and a desired size. The probe module assembly is then attached to a probe substrate. Thus, the probe card having a large size may be manufactured.

Method and apparatus for manufacturing a probe card

Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip portion and dummy tip portion regions. A sacrificial layer is formed to cover the dummy tip portion region including dummy tip portion. A beam portion is formed in connection with the tip portion, extending upward the dummy tip portion including the sacrificial layer. The method includes steps of selectively etching the substrate of the tip portion and floating the tip portion from the substrate. Accordingly, it minimizes physical and chemical damages on the tip portion while fabricating a probe card, providing stability thereto with smaller defects of the tip portion.

Method of fabricating cantilever type probe and method of fabricating probe card using the same

In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with respect to the solder paste are formed on the bump layer patterns. The solder paste is formed on the first wetting layer and the non-wetting layer pattern. The probes, which make contact with an object, are bonded to the solder paste. The solder paste on the non-wetting layer pattern reflows along a surface of the first wetting layer pattern to form an adhesive layer on the first wetting layer pattern. Thus, a sufficient amount of the solder paste, which is required for bonding the probes, may be provided to firmly bond the probes.

Method of bonding probes and method of manufacturing a probe card using the same

Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.

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Bucheon-si, South Korea

Yong-Hwi Jo