Taiwan Semiconductor Manufacturing Comp. Ltd.

Ying-Chieh Meng

Chui-Ya Peng

Nai-Han Cheng

Shih-Hao Lin

A semiconductor structure manufacturing system is provided. The system includes a load lock chamber, first chambers, second chambers and a first robot. The load lock chamber is configured to store wafers that are to be processed. The first chambers are configured to process the wafers. Each of the first chambers has first stage plates for supporting the wafers. The second chambers are configured to process a single wafer. Each of the second chambers has a second stage plate for supporting a wafer. The first robot is configured to transport the wafers from the load lock chamber to the first chambers. The first robot is arranged between the first chambers, the second chambers and the load lock chamber.

Wet processing system and system and method for manufacturing semiconductor structure

An ion implantation system including an ion implanter, a dopant source gas supply system and a monitoring system is provided. The ion implanter is inside a housing and includes an ion source unit. The dopant source gas supply system includes a first and a second dopant source gas storage cylinder in a gas cabinet outside of the housing and configured to supply a dopant source gas to the ion source unit, and a first and a second dopant source gas supply pipe coupled to respective first and second dopant source gas storage cylinders. Each of the first and second dopant source gas supply pipes includes an inner pipe and an outer pipe enclosing the inner pipe. The monitoring system is coupled to the outer pipe of each of the first and the second dopant source gas supply pipes.

Ion implanter toxic gas delivery system

The present disclosure describes an ion implantation system that includes a bushing designed to reduce the accumulation of IMP by-produces on the bushing's inner surfaces. The ion implantation system can include a chamber, an ion source configured to generate an ion beam, and a bushing coupling the ion source and the chamber. The bushing can include (i) a tubular body having an inner surface, a first end, and a second end and (ii) multiple angled trenches disposed within the inner surface of the tubular body, where each of the multiple angled trenches extends towards the second end of the tubular body.

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Taichung, Taiwan

Ying-Chieh Meng