Chroma Ate Inc.

Yi-Yen Lin

Wei-Chih Chen

Ben-Mou Yu

Shen-Hao Tsai

A wafer inspection system includes a carrier device, a probe card, a first metal kit and a surround separating unit. The probe card includes a detection portion and a conductive layer surrounding the detection portion and disposed on its bottom surface. The first metal kit is configured at a bottom portion of the probe card and coupled to the conductive layer and includes a first window for the detection portion to extend out and a first ring piece extending from a periphery of the first window. The surround separating unit includes a conductive wraparound body surrounding and laterally enclosing the detection portion and a wafer to be inspected during probing. The probe card, first metal kit, carrier device, and conductive wraparound body jointly define an space range, shielding the detection portion and wafer from external noise or interference sources, thereby improving inspection accuracy.

Wafer inspection system

A wafer inspection system and a wafer inspection equipment thereof are provided. The wafer inspection system includes a susceptor device, probe card, and bridge module. The susceptor device includes a susceptor unit for placing a wafer under test. The probe card includes a probing portion and conducting portion. The conducting portion is disposed at the periphery of the probing portion and has a contact surface. The bridge module includes transmission units extended upward, positioned adjacent to a wafer placement area, and coupled to the susceptor unit. When the probing portion comes into contact with a testing point of the wafer, the contact surface of the conducting portion gets coupled to the transmission units to transmit a test signal to the probe card via the transmission units and conducting portion and thus form a test loop. Thus, the test loop path can be shortened and the accuracy of signal transmission and inspection can be enhanced.

Growing community of inventors

Taoyuan, Taiwan

Yi-Yen Lin