Applied Materials, Inc.

Yi Nung Wu

Boon Sen Chan

Siamak Salimian

Yixing Lin

Chien-Min Liao

Sidda Reddy Kurakula

Hsiu Yang

Abyaya Dhar

Yash Chhabra

Chandrasekhar Roy

Joseph Liu

Chi-Feng Liu

The present disclosure includes edge defect detection via image analytics. A method includes identifying an image of an edge of a susceptor pocket formed by a susceptor of a substrate processing system. The method further includes predicting, based on the image, whether property values of the edge of the susceptor meet threshold values. The method further includes, responsive to the property values of the edge meeting threshold values, causing performance of a corrective action associated with the susceptor.

Edge defect detection via image analytics

Methods and apparatus for a baking chamber for processing a chamber component are provided herein. In some embodiments, a baking chamber includes: an enclosure defining a first chamber, wherein the first chamber comprises: a first chamber body having a first floor and first sidewalls that couple the first floor to a first lid of the first chamber body to define a first interior volume; a first support disposed in the first interior volume; a first gas line disposed in the first interior volume proximate the first lid; a first showerhead disposed between the first gas line and the first support; a first exhaust coupled to the first floor; and a first heater disposed in the first interior volume between the first support and the first floor; and wherein the enclosure includes a door configured to facilitate transferring the chamber component into and out of the enclosure.

High throughput and metal contamination control oven for chamber component cleaning process

Growing community of inventors

Hsinchu, Taiwan

Yi Nung Wu