Changxin Memory Technologies, Inc.

Yi Jiang

Deyuan Xiao

Guangsu Shao

Yunsong Qiu

Xingsong Su

Weiping Bai

Youming Liu

Yuhan Zhu

Juanjuan Huang

A method for manufacturing a semiconductor structure includes providing a substrate; forming mutually parallel first trenches extending along a first direction in the substrate and first isolation structures filling the first trenches; forming mutually parallel second trenches extending along a second direction in the substrate and in the first isolation structures, the first and second trenches dividing the substrate to form active pillars, and a depth of the second trenches being less than that of the first trenches; forming second isolation structures alternately arranged with the first isolation structures along the second direction at bottoms of the second trenches, top surfaces of the second isolation structures being lower than bottom surfaces of the second trenches located in the first isolation structures; forming bit line structures on the second isolation structures; and forming word line structures above the bit line structures.

Semiconductor structure, method for manufacturing same and memory

Embodiments relate to a three-dimensional semiconductor structure and a formation method thereof. The three-dimensional semiconductor structure includes: a substrate; and a device structure positioned on a top surface of the substrate. The device structure includes memory rows arranged at intervals along a first direction, each of the memory rows includes memory cells arranged at intervals along a second direction and a gap between adjacent two of the memory cells, and each of the memory cells includes a first stacked layer and a word line structure. The word line structure includes a first part positioned in the first stacked layer and a second part extending out of the first stacked layer along the first direction. At least adjacent two of the memory rows exist, and the second part of the memory cell in one of the memory rows extends into the gap in another one of the memory rows.

Three-dimensional semiconductor structure and formation method thereof

The present disclosure provides a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base including a first region and a second region, where a plurality of active pillars are arranged at intervals in the base located in the first region; forming a first dielectric layer on the base, where the first dielectric layer covers the plurality of active pillars; forming a first mask layer with a first mask pattern on the first dielectric layer; forming a second mask layer with a second mask pattern on the first mask layer; forming a third mask layer with a third mask opening, where the third mask opening is used to expose the first region; and removing part of the first dielectric layer by using the first mask layer, the second mask layer, and the third mask layer as a mask.

Semiconductor structure and manufacturing method thereof

Embodiments relate to a method for fabricating a semiconductor structure. The method includes: providing a substrate, where pillars arranged in an array are formed on a surface of the substrate, and bit lines extending along a first direction are formed at bottoms of the pillars; forming, between adjacent two of the pillars, a first groove extending along a second direction; forming an isolation layer on the substrate, where the isolation layer is filled in the first groove and is filled between adjacent two of the bit lines; etching the isolation layer to expose a surface of the pillar, where a first sub isolation layer positioned in the first groove is lower than a second sub isolation layer; forming a word line surrounding a side wall of the pillar, where a surface of the word line is not higher than a surface of the second sub isolation layer; and forming a dielectric layer on the word line.

Method for fabricating a semiconductor structure with pillar array and semiconductor structure

A method for forming a memory includes the following operations: a substrate and a semiconductor layer located on the substrate are formed; the semiconductor layer is patterned to form a plurality of first isolation structures and channel regions, each first isolation structure includes a first through hole and a second through hole, and a first isolation pillar located between the first through hole and the second through hole; a first filling layer filling up the first through hole and the second through hole is formed; the first isolation pillar is removed to form a third through hole located in the first filling layer; a barrier layer filling up the third through hole is formed; the channel regions are exposed by removing the first filling layer; and a gate layer covering surfaces of the channel regions is formed.

Memory and method for forming same

A semiconductor structure and a method for manufacturing a semiconductor structure are provided. The method for manufacturing the semiconductor structure includes: a substrate is provided: a plurality of semiconductor channels arrayed in a first direction and a second direction are formed on the substrate: a plurality of bit lines extending in the first direction are formed, in which the bit lines is located in the substrate: and a plurality of word lines extending in the second direction are formed, in which two word lines adjacent to each other in the first direction are spaced apart from each other in a direction perpendicular to a surface of the substrate: and a sidewall conductive layer is formed, in which the sidewall conductive layer is located above one of the two word lines adjacent to each other, and is arranged in the same layer as the other of the two word lines.

Semiconductor structure and method for manufacturing semiconductor structure

The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes: a base, including a semiconductor substrate, the semiconductor substrate is provided with first trenches extending along a first direction and second trenches extending along a second direction, the first trenches intersect with the second trenches to form a plurality of semiconductor pillars on the semiconductor substrate, the second trench is filled with a first dielectric layer, a second dielectric layer is provided on a top of the semiconductor pillar, and a third dielectric layer is provided on a sidewall of the first trench; an isolation layer, located in the semiconductor substrate below the first trenches and extending along the second direction; and a bit line, located on a surface of the isolation layer and extending along the second direction, the bit line is connected to a bottom of the semiconductor pillar.

The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base; forming a plurality of first trenches arranged in parallel at intervals and extending along a first direction, and an initial active region between two adjacent ones of the first trenches, wherein the initial active region includes a first initial source-drain region close to a bottom of the first trench, a second initial source-drain region away from the bottom of the first trench, and an initial channel region located between the first initial source-drain region and the second initial source-drain region; forming a protective dielectric layer, wherein the protective dielectric layer covers a sidewall of the second initial source-drain region and a sidewall of the initial channel region; thinning the first initial source-drain region.

Growing community of inventors

Hefei, China

Yi Jiang