Taiwan Semiconductor Manufacturing Comp. Ltd.

Yi-Huang Wu

Chih-Lin Wang

Hsin-Hsiang Tseng

Ching-Chen Hao

Der-Chen Chen

Jelin Wang

Meng Yi Sun

Tzong-Sheng Chang

Cheng-Te Lin

A memory device includes a bottom electrode, a resistance switching element over the bottom electrode, a top electrode over the resistance switching element, and a dielectric layer. The dielectric layer surrounds the bottom electrode, the resistance switching element, and the top electrode. The resistance switching element has a first portion between the top electrode and the dielectric layer.

Memory device having resistance switching layer and integrated circuit device having resistance switching layer

A method for manufacturing a memory device is provided. The method includes etching an opening in a first dielectric layer; forming a bottom electrode, a resistance switching element, and a top electrode in the opening in the first dielectric layer; forming a second dielectric layer over the bottom electrode, the resistance switching element, and the top electrode; and forming an electrode via connected to a top surface of the top electrode in the second dielectric layer.

Method for manufacturing memory device having resistance switching layer

A memory device includes a substrate, an etch stop layer, a protective layer, and a resistance switching element. The substrate has a memory region and a logic region, and includes a metallization pattern therein. The etch stop layer is over the substrate, and has a first portion over the memory region and a second portion over the logic region. The protective layer covers the first portion of the etch stop layer. The protective layer does not cover the second portion of the etch stop layer. The resistance switching element is over the memory region, and the resistance switching element is electrically connected to the metallization pattern through the etch stop layer and the protective layer.

Memory device having resistance switching element surrounding top electrode and integrated circuit device including the same

A device includes a semiconductor substrate, a first Metal-Oxide-Semiconductor (MOS) device, and a second MOS device of a same conductivity as the first MOS device. The first MOS device includes a first gate stack over the semiconductor substrate, and a first stressor adjacent to the first gate stack and extending into the semiconductor substrate. The first stressor and the first gate stack have a first distance. The second MOS device includes a second gate stack over the semiconductor substrate, and a second stressor adjacent to the second gate stack and extending into the semiconductor substrate. The second stressor and the second gate stack have a second distance greater than the first distance.

MOS devices with thinned gate spacers and methods of thinning the gate spacers

MOS devices with modulated performance and methods for forming the same

Methods are disclosed of forming and removing a reacted layer on a surface of a recess to provide mechanisms for improving thickness uniformity of a semiconductor material formed in the recess. The improved thickness uniformity in turn improves the uniformity of device performance.

Reacted layer for improving thickness uniformity of strained structures

An FET semiconductor substrate includes source/drain regions with an outer buried contact region overlapping the drain region, a gate oxide layer, and a polysilicon layer over the gate oxide layer. An inner buried contact opening through the polysilicon and the gate oxide layer reaches down to the substrate over the outer buried contact region. An inner buried contact region, within the outer buried contact region, is self-aligned with the buried contact opening. A second polysilicon layer formed over the gate oxide layer reaches down through the buried contact opening into contact with the inner buried contact region. An interconnect and a gate electrode are formed from the polysilicon layers. Source/drain regions are self-aligned with the gate electrode and whereas the drain region is spaced from the inner buried contact region, the outer buried contact region interconnects the drain region with the inner buried contact region.

Outer buried contact region connecting drain region to inner buried

A method of forming an FET device starts by forming a sacrificial layer over a semiconductor substrate and an outer buried contact region is produced by ion implantation into the substrate, followed by stripping the sacrificial layer, forming a gate oxide layer, and depositing polysilicon over the gate oxide layer. Then, etch an inner buried contact opening through the polysilicon and the gate oxide layer down to the substrate over the outer buried contact region forming an etched buried contact opening. Implant dopant into the substrate through the inner buried contact opening in the second mask to dope the substrate forming the inner buried contact region within the outer buried contact region self-aligned with the etched buried contact opening. Form a blanket, second polysilicon layer over the gate oxide layer reaching down through the etched buried contact opening into electrical and mechanical contact with the inner buried contact region. Etch to form the interconnect and the gate electrode from the polysilicon layers, and form source/drain regions.

Growing community of inventors

Zhubei, Taiwan

Yi-Huang Wu