Mosel Vitelic Corporation

Yi-Hua Chin

Dong-Tay Tsai

Hua-Jen Tseng

Chun-chieh Lee

Chun-Chieh Lee

Pei-Wei Tsai

Chih-Hsien Chang

Huan-Jen Tseng

Hua-jen Tseng

A chemical mechanical polishing apparatus has a plurality of electric machines for executing mechanical polishing motions, at least two control systems for controlling the mechanical polishing motions, at least two signal wires connected with the two control systems for transmitting signals of the two control systems, and a wave filter comprising two terminals connected with the two signal wires respectively for filtering out the signal whose voltage exceeds a predetermined value in the two signal wires.

Chemical mechanical polishing apparatus with stable signals

An inspection device for examining a piece of aperture graphite of an extraction electrode, and the aperture graphite includes a to-be-examined curve and a to-be-examined engagement portion. The inspection device includes a sidewall surface having a standard curve marked thereon, and an examination engagement portion having a predetermined positional relationship with the sidewall surface. After the to-be-examined engagement portion is engaged with the examination engagement portion, and after the to-be-examined curve is projected onto the sidewall surface, the suitability of the aperture graphite can be determined according to the amount of differences between the projected to-be-examined curve and the standard curve.

Inspection device for examining a piece of aperture graphite of an extraction electrode

A slurry nozzle for supplying slurry in chemical mechanical polishing (CMP) including at least one slurry line, a slurry nozzle enclosure for accommodating the slurry line, and a baffle ring mounted at one end of the slurry nozzle enclosure. A plurality of apertures is formed on the sidewall of the slurry line for the slurry to spray out. The slurry spraying out from the slurry line flows down along the inner sidewall of the slurry baffle ring after the slurry impinges onto the slurry baffle ring.

Slurry nozzle

The present invention provides a control device for maintaining a chemical mechanical polishing (CMP) machine in a wet mode, the CMP machine comprising a polishing pad, a slurry sprinkler for sprinkling liquid or deionized water, and at least one carrier head, the control device comprising a sensor positioned on the CMP machine for sensing the operational status of the slurry sprinkler and generating a corresponding sensing signal; and a control unit electrically connected to the sensor for measuring the time period over which the slurry sprinkler is closed wherein when the measured time period exceeds a predetermined length, the control unit will either send a warning signal or turn on the slurry sprinkler to sprinkle liquid onto the polishing pad according to a predetermined process so as to maintain the polishing pad in a wet mode.

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Taipei, Taiwan

Yi-Hua Chin