Taiwan Semiconductor Manufacturing Comp. Ltd.

Yen-Pu Hsu

Mei-Jen Wu

Wei Cheng Hsien

Cheng Hsien Wei

Systems and methods for etching operation management. A process controller acquires a line width on a processed wafer, determines a first Critical Dimension (CD) bias by subtracting the measured width from a target width, determines an adjusted target width by providing a first and a second etching duration, determines a second CD bias by providing the adjusted target width, determines third etching duration corresponding to the second CD bias, receives an event from an etching tool, and directs the etching tool to perform etching operations on an initiated wafer for the third etching duration.

Etching operation management systems and methods

A computer implemented method for estimating manufacturing target bias for products in manufacturing tools. The method first establishes a first data set according to manufacturing target bias history based on a correlation with tools used. The manufacturing tools comprise a first manufacturing tool and other manufacturing tools. Next, a testing operation is executed for a predicted product in the first manufacturing tool to obtain a first predicted manufacturing target bias. Finally, manufacturing target bias of the predicted product in the other manufacturing tools is calculated according to the first data set and the first predicted manufacturing target bias.

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Jhongli, Taiwan

Yen-Pu Hsu